5秒后页面跳转
K4H560838E-TLAA0 PDF预览

K4H560838E-TLAA0

更新时间: 2024-11-01 14:51:47
品牌 Logo 应用领域
三星 - SAMSUNG 动态存储器双倍数据速率光电二极管内存集成电路
页数 文件大小 规格书
24页 214K
描述
DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66

K4H560838E-TLAA0 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSSOP,针数:66
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.11
访问模式:FOUR BANK PAGE BURST最长访问时间:0.75 ns
其他特性:AUTO/SELF REFRESHJESD-30 代码:R-PDSO-G66
JESD-609代码:e0长度:22.22 mm
内存密度:268435456 bit内存集成电路类型:DDR DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:66
字数:33554432 words字数代码:32000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:32MX8
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.2 mm自我刷新:YES
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:30宽度:10.16 mm
Base Number Matches:1

K4H560838E-TLAA0 数据手册

 浏览型号K4H560838E-TLAA0的Datasheet PDF文件第2页浏览型号K4H560838E-TLAA0的Datasheet PDF文件第3页浏览型号K4H560838E-TLAA0的Datasheet PDF文件第4页浏览型号K4H560838E-TLAA0的Datasheet PDF文件第5页浏览型号K4H560838E-TLAA0的Datasheet PDF文件第6页浏览型号K4H560838E-TLAA0的Datasheet PDF文件第7页 
DDR SDRAM 256Mb E-die (x4, x8)  
DDR SDRAM  
256Mb E-die DDR SDRAM Specification  
66 TSOP-II  
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,  
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.  
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,  
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,  
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL  
INFORMATION IN THIS DOCUMENT IS PROVIDED  
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.  
1. For updates or additional information about Samsung products, contact your nearest Samsung office.  
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar  
applications where Product failure couldresult in loss of life or personal or physical harm, or any military or  
defense application, or any governmental procurement to which special terms or provisions may apply.  
Samsung Electronics reserves the right to change products or specification without notice.  
Rev. 1.3 April. 2005  

与K4H560838E-TLAA0相关器件

型号 品牌 获取价格 描述 数据表
K4H560838E-TLB0 SAMSUNG

获取价格

128Mb DDR SDRAM
K4H560838E-TLB00 SAMSUNG

获取价格

DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66
K4H560838E-TLB0T SAMSUNG

获取价格

DDR DRAM, 32MX8, 0.75ns, CMOS, PDSO66
K4H560838E-TLB3 SAMSUNG

获取价格

256Mb E-die DDR SDRAM Specification 66 TSOP-II
K4H560838E-TLB3T SAMSUNG

获取价格

暂无描述
K4H560838E-TLCC0 SAMSUNG

获取价格

DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66
K4H560838E-TLCCT SAMSUNG

获取价格

DDR DRAM, 32MX8, 0.65ns, CMOS, PDSO66
K4H560838E-UC/LA2 SAMSUNG

获取价格

256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
K4H560838E-UC/LAA SAMSUNG

获取价格

256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)
K4H560838E-UC/LB0 SAMSUNG

获取价格

256Mb E-die DDR SDRAM Specification 66 TSOP-II with Pb-Free (RoHS compliant)