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JS28F064M29EWTA

更新时间: 2024-01-18 18:35:33
品牌 Logo 应用领域
镁光 - MICRON PC
页数 文件大小 规格书
132页 1301K
描述
Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

JS28F064M29EWTA 数据手册

 浏览型号JS28F064M29EWTA的Datasheet PDF文件第126页浏览型号JS28F064M29EWTA的Datasheet PDF文件第127页浏览型号JS28F064M29EWTA的Datasheet PDF文件第128页浏览型号JS28F064M29EWTA的Datasheet PDF文件第129页浏览型号JS28F064M29EWTA的Datasheet PDF文件第131页浏览型号JS28F064M29EWTA的Datasheet PDF文件第132页 
Micron Confidential and Proprietary  
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory  
Asynchronous Interface Timing Diagrams  
Figure 99: INTERNAL DATA MOVE (85h-10h) with Random Data Input with Internal ECC Enabled  
t
t
R_ECC  
PROG_ECC  
R/B#  
Address  
Address  
Address  
D
I/O[7:0]  
00h  
35h  
70h  
Status  
00h  
85h  
Data 85h  
Data 10h  
70h  
OUT  
(5 cycles)  
(5 cycles)  
(2 cycles)  
Source address  
DOUT is optional Destination address  
SR bit 0 = 0 READ successful  
SR bit 1 = 0 READ error  
Column address 1, 2  
(Unlimitted repetitions are possible)  
Figure 100: ERASE BLOCK Operation  
CLE  
CE#  
tWC  
WE#  
tWB  
tWHR  
ALE  
RE#  
tBERS  
Busy  
Row  
Row  
Row  
Status  
I/O[7:0]  
RDY  
60h  
D0h  
70h  
add 1  
add 2  
add 3  
Row address  
READ STATUS  
command  
I/O0  
I/O0  
=
=
0, Pass  
1, Fail  
Don’t Care  
PDF: 09005aef83b25735  
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
130  
© 2009 Micron Technology, Inc. All rights reserved.  

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