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JS28F064M29EWTA PDF预览

JS28F064M29EWTA

更新时间: 2024-01-18 18:35:33
品牌 Logo 应用领域
镁光 - MICRON PC
页数 文件大小 规格书
132页 1301K
描述
Anticipating electrostatic discharge (ESD) technology roadmap trends with ESD control hardening precautions for the handling and assembly of semiconductor die, wafers, packages, and PCBs.

JS28F064M29EWTA 数据手册

 浏览型号JS28F064M29EWTA的Datasheet PDF文件第126页浏览型号JS28F064M29EWTA的Datasheet PDF文件第127页浏览型号JS28F064M29EWTA的Datasheet PDF文件第128页浏览型号JS28F064M29EWTA的Datasheet PDF文件第129页浏览型号JS28F064M29EWTA的Datasheet PDF文件第130页浏览型号JS28F064M29EWTA的Datasheet PDF文件第131页 
Micron Confidential and Proprietary  
4Gb, 8Gb, 16Gb: x8, x16 NAND Flash Memory  
Revision History  
• Removed Endurance spec from Features and Parameter Page Data Structure Table  
• Filled in missing values to READ ID Table  
• Changed tBERS from .5 to .7 in Electrical Specifications – Program/Erase Characteris-  
tics  
• Replaced Status Register Definition table with the correct one for ECC  
Rev. D – 03/10  
• Updated value for byte 113 to 01h; value for byte 114 to 0Eh in Parameter Page Data  
Structure Tables  
• Updated note 6 in Electrical Specifications - Program/Erase Characteristics to say  
"disabled"  
• Fixed note typo in Features  
• Updated OTP Protect - changed to protect by block; removed protect by page  
• Updated 1.8V Active Current specs for single die and fixed typos in DC tables  
Rev. C – 01/10  
• Updated READ ID Tables to include the following value changes: Byte 1 –  
MT29F4G08ABBDA (4Gb, x8, 1.8V) Value: ACh, MT29F4G16ABBDA (4Gb, x16, 1.8V)  
Value: BCh; Byte 2 – MT29F4G08ABBDA Value: 90h, MT29F4G16ABBDA Value: 90h;  
Byte 3 – MT29F4G08ABBDA Value: 15h, MT29F4G16ABBDA Value: 55h; Byte 4 –  
MT29F4G08ABBDA Value: 56h, MT29F4G16ABBDA Value: 56h; Removed H4 from  
part numbers  
• Added Bare Die Parameter Page Data Structure Table  
• Removed Boot Block  
Rev. B – 10/09  
• Removed part numbers: MT29F4G08ABBDAWP and MT29F4G16ABBDAWP  
• Updated "Internal Data Move with Internal ECC Enabled" graphic spec from tR to  
tR_ECC  
• Updated "Internal Data Move with Random Data Input with Internal ECC Enabled"  
graphic spec from tR to tR_ECC  
• Updated Boot Block Operation to include dual-plane restrictions  
• Added tRCBSY spec to Electrical Specifications - Program/Erase Characteristics  
• Added note for tPROG and tPROG_ECC specifications to Electrical Specifications -  
Program/Erase Characteristics  
• Moved note from tRHW to tRHZ in AC Characteristics and Operating Conditions  
Rev. A – 07/09  
• Initial release; Advance status  
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900  
www.micron.com/productsupport Customer Comment Line: 800-932-4992  
Micron and the Micron logo are trademarks of Micron Technology, Inc.  
All other trademarks are the property of their respective owners.  
This data sheet contains minimum and maximum limits specified over the power supply and temperature range set forth herein.  
Although considered final, these specifications are subject to change, as further product development and data characterization some-  
times occur.  
PDF: 09005aef83b25735  
m60a_4gb_8gb_16gb_ecc_nand.pdf - Rev. N 10/12 EN  
Micron Technology, Inc. reserves the right to change products or specifications without notice.  
132  
© 2009 Micron Technology, Inc. All rights reserved.  

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