JMSH1010AK
TO-252-3L Package Information
Package Outline Type-A
E
b3
c1
MILLIMETER
DIM.
MIN.
2.18
0
NOM.
2.30
--
MAX.
2.39
0.13
0.89
0.61
0.58
6.23
--
A
A1
b
0.64
0.40
0.46
5.97
5.05
6.35
4.32
5.21
0.76
0.50
0.50
6.10
--
c
E1
c1
D
D1
E
c
b
6.60
--
6.73
--
e
Detail A
E1
b3
e
Bottom View
Side View
Top View
5.38
2.29 BSC
10.00
--
5.55
H
9.40
0.89
1.40
10.40
1.27
1.78
L
L2
V1
V2
--
7° REF
--
Front View
0°
6°
L2
Detail A
Package Outline Type-B
E
MILLIMETER
DIM.
b3
MIN.
2.10
0
NOM.
2.30
--
MAX.
2.40
0.13
0.86
5.55
0.60
0.58
6.30
c1
A
A1
b
0.66
5.21
0.40
0.44
5.90
0.76
5.38
0.50
0.50
6.10
5.30REF
6.60
-
b3
c
E1
c1
D
D1
E
c
b
6.40
4.63
6.80
-
e
E1
e
Detail A
Bottom View
Side View
Top View
2.29 BSC
10.00
--
H
9.50
1.09
1.35
10.70
1.21
1.65
L
L2
V1
V2
--
7° REF
--
0°
6°
L2
Front View
Detail A
Recommended Soldering Footprint
6.250
1.500
4.572
DIMENSIONS:MILLIMETERS
JieJie Microelectronics Co., Ltd.
All product information are copyrighted and subject to legal disclaimers
Rev. 1.2
Page 5 of 5