ꢀꢁꢂ ꢃ ꢄꢅ ꢆꢆ ꢇ ꢈ ꢀ ꢁꢉ ꢃꢄ ꢅꢆꢆꢇ
ꢊꢋꢌ ꢍ ꢎ ꢏꢐ ꢁꢑ ꢒꢌꢓ ꢔꢕ ꢑꢏꢑꢊꢒ ꢑꢏ ꢓꢖꢔ ꢒ ꢒ ꢑꢖꢑ ꢊ ꢗ ꢍꢔ ꢘ ꢏꢗ ꢍꢙ ꢘꢀ
ꢚ ꢔꢓ ꢄ ꢅꢍ ꢑꢌꢖ ꢌꢁꢊ ꢘ ꢖꢑ ꢀ ꢑꢓ
SCLS099F − DECEMBER 1982 − REVISED SEPTEMBER 2003
SN54HC112 . . . J OR W PACKAGE
SN74HC112 . . . D OR N PACKAGE
(TOP VIEW)
D
D
D
D
D
D
Wide Operating Voltage Range of 2 V to 6 V
Outputs Can Drive Up To 10 LSTTL Loads
Low Power Consumption, 40-µA Max I
CC
1CLK
1K
V
CC
1
2
3
4
5
6
7
8
16
15
14
13
Typical t = 13 ns
pd
4-mA Output Drive at 5 V
1CLR
2CLR
2CLK
1J
Low Input Current of 1 µA Max
1PRE
1Q
12 2K
description/ordering information
11
10
9
1Q
2J
2Q
2PRE
2Q
The ’HC112 devices contain two independent J-K
negative-edge-triggered flip-flops. A low level at
the preset (PRE) or clear (CLR) inputs sets or
resets the outputs, regardless of the levels of the
other inputs. When PRE and CLR are inactive
(high), data at the J and K inputs meeting the
setup time requirements are transferred to the
outputs on the negative-going edge of the clock
(CLK) pulse. Clock triggering occurs at a voltage
level and is not directly related to the fall time of the
CLK pulse. Following the hold-time interval, data
at the J and K inputs may be changed without
affecting the levels at the outputs. These versatile
flip-flops perform as toggle flip-flops by tying J and
K high.
GND
SN54HC112 . . . FK PACKAGE
(TOP VIEW)
3
2
1
20 19
18
2CLR
2CLK
NC
1J
1PRE
NC
4
5
6
7
8
17
16
15 2K
14
9 10 11 12 13
1Q
2J
1Q
NC − No internal connection
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP − N
SOIC − D
Tube of 25
Tube of 40
Reel of 2500
Reel of 250
Tube of 25
Tube of 150
Tube of 55
SN74HC112N
SN74HC112N
SN74HC112D
−40°C to 85°C
SN74HC112DR
SN74HC112DT
SNJ54HC112J
SNJ54HC112W
SNJ54HC112FK
HC112
CDIP − J
CFP − W
LCCC − FK
SNJ54HC112J
−55°C to 125°C
SNJ54HC112W
SNJ54HC112FK
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2003, Texas Instruments Incorporated
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