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JANSF2N7390U PDF预览

JANSF2N7390U

更新时间: 2024-11-30 14:56:43
品牌 Logo 应用领域
英飞凌 - INFINEON 开关脉冲晶体管
页数 文件大小 规格书
8页 355K
描述
Rad hard, -200V, -4A, single, P-channel MOSFET, R4 in an 18-pin LCC packageage - 18-pin LCC, 300 krad(Si) TID, QPL

JANSF2N7390U 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:CHIP CARRIER, R-CQCC-N15Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.17
雪崩能效等级(Eas):171 mJ外壳连接:SOURCE
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:200 V
最大漏极电流 (Abs) (ID):4 A最大漏极电流 (ID):4 A
最大漏源导通电阻:0.92 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-CQCC-N15JESD-609代码:e0
元件数量:1端子数量:15
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):25 W
最大脉冲漏极电流 (IDM):16 A认证状态:Qualified
参考标准:MIL-19500/630子类别:Other Transistors
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:NO LEAD端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

JANSF2N7390U 数据手册

 浏览型号JANSF2N7390U的Datasheet PDF文件第2页浏览型号JANSF2N7390U的Datasheet PDF文件第3页浏览型号JANSF2N7390U的Datasheet PDF文件第4页浏览型号JANSF2N7390U的Datasheet PDF文件第5页浏览型号JANSF2N7390U的Datasheet PDF文件第6页浏览型号JANSF2N7390U的Datasheet PDF文件第7页 
PD-91804F  
IRHE9230  
JANSR2N7390U  
RADIATION HARDENED  
POWER MOSFET  
SURFACE MOUNT (LCC-18)  
200V, P-CHANNEL  
REF: MIL-PRF-19500/630  
RAD-Hard HEXFET TECHNOLOGY  
Product Summary  
Part Number  
IRHE9230  
Radiation Level RDS(on)  
ID  
QPL Part Number  
100 kRads(Si)  
300 kRads(Si)  
-4.0A  
-4.0A  
JANSR2N7390U  
JANSF2N7390U  
0.80  
0.80  
IRHE93230  
Description  
Features  
Single Event Effect (SEE) Hardened  
IR HiRel RAD-Hard HEXFET technology provides high  
performance power MOSFETs for space applications.  
This technology has over a decade of proven performance  
and reliability in satellite applications. These devices have  
been characterized for both Total Dose and Single Event  
Effects (SEE). The combination of low Rdson and low gate  
charge reduces the power losses in switching applications  
such as DC to DC converters and motor control. These  
devices retain all of the well established advantages of  
MOSFETs such as voltage control, fast switching, ease of  
paralleling and temperature stability of electrical  
parameters.  
Low RDS(on)  
Low Total Gate Charge  
Simple Drive Requirements  
Ease of Paralleling  
Hermetically Sealed  
Ceramic Package  
Light Weight  
Surface Mount  
ESD Rating: Class 1B per MIL-STD-750,  
Method 1020  
Absolute Maximum Ratings  
Parameter  
Pre-Irradiation  
Units  
-4.0  
ID @ VGS = -12V, TC = 25°C Continuous Drain Current  
ID @ VGS = -12V, TC = 100°C Continuous Drain Current  
-2.4  
-16  
25  
A
IDM  
Pulsed Drain Current  
W
W/°C  
V
PD @TC = 25°C  
Maximum Power Dissipation  
0.2  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy   
Avalanche Current   
± 20  
171  
VGS  
EAS  
IAR  
mJ  
A
-4.0  
2.5  
mJ  
V/ns  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy   
Peak Diode Recovery dv/dt   
Operating Junction and  
Storage Temperature Range  
Lead Temperature  
-27  
-55 to + 150  
TSTG  
°C  
g
300 (for 5s)  
0.49 (Typical)  
Weight  
For Footnotes, refer to the page 2.  
1
2017-06-15  

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