1N5614US thru 1N5622US
VOIDLESS-HERMETICALLY-SEALED
SURFACE MOUNT STANDARD
RECOVERY GLASS RECTIFIERS
S C O T T S D A L E D I V I S I O N
DESCRIPTION
APPEARANCE
This “standard recovery” surface mount rectifier diode series is military qualified to MIL-
PRF-19500/427 and is ideal for high-reliability applications where a failure cannot be
tolerated. These industry-recognized 1.0 Amp rated rectifiers for working peak reverse
voltages from 200 to 1000 volts are hermetically sealed with voidless-glass construction
using an internal “Category I” metallurgical bond. These devices are also available in
axial-leaded thru-hole package configurations (see separate data sheet for 1N5614 thru
1N5622). Microsemi also offers numerous other rectifier products to meet higher and
lower current ratings with various recovery time speed requirements including fast and
ultrafast device types in both through-hole and surface mount packages.
Package “A”
or D-5A
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES
APPLICATIONS / BENEFITS
•
Surface mount package series equivalent to the
JEDEC registered 1N5614 to 1N5622 series
•
•
•
Standard recovery 1 Amp rectifiers 200 to 1000 V
Military and other high-reliability applications
General rectifier applications including bridges, half-
bridges, catch diodes, etc.
High forward surge current capability
Extremely robust construction
•
•
•
•
•
Voidless hermetically sealed glass package
Triple-Layer Passivation
•
•
•
Internal “Category I” Metallurgical bonds
Working Peak Reverse Voltage 200 to 1000 Volts.
Low thermal resistance
JAN, JANTX, JANTXV, and JANS available per MIL-
PRF-19500/427
•
Controlled avalanche with peak reverse power
capability
•
Axial-leaded equivalents also available (see separate
data sheet for 1N5614 thru 1N5622)
•
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
MECHANICAL AND PACKAGING
•
•
•
•
Junction & Storage Temperature: -65oC to +200oC
Thermal Resistance: 13oC/W junction to end cap
Thermal Impedance: 4.5oC/W @ 10 ms heating time
•
•
CASE: Hermetically sealed voidless hard glass
with Tungsten slugs
TERMINALS: End caps are Copper with Tin/Lead
(Sn/Pb) finish. Note: Previous inventory had solid
Silver end caps with Tin/Lead (Sn/Pb) finish.
Average Rectified Forward Current (IO): 1.0 Amps @
TA = 55ºC and 0.75 Amps @ TA = 100ºC
•
•
•
•
MARKING & POLARITY: Cathode band only
TAPE & REEL option: Standard per EIA-481-B
WEIGHT: 193 mg
•
•
Forward Surge Current: 30 Amps @ 8.3 ms half-sine
Solder Temperatures: 260ºC for 10 s (maximum)
See package dimensions and recommended pad
layout on last page
ELECTRICAL CHARACTERISTICS
WORKING
PEAK
MINIMUM
BREAKDOWN
VOLTAGE
AVERAGE
RECTIFIED
CURRENT
IO @ TA
FORWARD
VOLTAGE
(MAX.)
REVERSE
CURRENT
(MAX.)
MAXIMUM
SURGE
CURRENT
IFSM
REVERSE
RECOVERY
(NOTE 3)
trr
REVERSE
TYPE
VF @ 3A
VOLTAGE VRWM
VBR @ 50μA
IR @ VRWM
(NOTE 2)
AMPS
VOLTS
VOLTS
VOLTS
μA
μs
55oC
25oC
100oC
25
25
25
25
25
1N5614US
1N5616US
1N5618US
1N5620US
1N5622US
200
400
600
800
1000
220
440
660
880
1100
0.5
0.5
0.5
0.5
0.5
30
30
30
30
30
2.0
2.0
2.0
2.0
2.0
0.8 MIN.
1.3 MAX.
NOTE 1: From 1 Amp at TA = 55oC, derate linearly at 5.56 mA/ oC to 0.75 Amp at TA = 100oC. From TA = 100oC,
derate linearly at 7.5 mA/oC to 0 Amps at TA = 200 oC. These ambient ratings are for PC boards where thermal
resistance from mounting point to ambient is sufficiently controlled where TJ(max) does not exceed 175 oC.
NOTE 2: TA = 100 oC, f = 60 Hz, IO = 750 mA for ten 8.3 ms surges @ 1 minute intervals
NOTE 3: IF = 0.5A, IRM = 1A, IR(REC) = 0.250A
Copyright © 2009
10-06-2009 REV D; SA7-45.pdf
Microsemi
Page 1
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503