Datasheet > IS71V16F32ES08-7070BI

IS71V16F32ES08-7070BI

更新时间： 2024-09-25 19:10:07

品牌	Logo	应用领域
美国芯成 - ISSI		静态存储器内存集成电路
页数	文件大小	规格书
48页	321K
描述
Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73

阅读下载

中文翻译

获取价格

技术参数
数据手册

如果您发现信息不准确，欢迎纠错

IS71V16F32ES08-7070BI 技术参数

是否无铅：	含铅	是否Rohs认证：	不符合
生命周期：	Obsolete	零件包装代码：	BGA
包装说明：	8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73	针数：	73
Reach Compliance Code：	compliant	HTS代码：	8542.32.00.71
风险等级：	5.92	最长访问时间：	70 ns
其他特性：	ALSO CONTAINS 512K X 16/1M X 8 SRAM	JESD-30 代码：	R-PBGA-B73
JESD-609代码：	e0	长度：	11.6 mm
内存密度：	33554432 bit	内存集成电路类型：	MEMORY CIRCUIT
内存宽度：	16	混合内存类型：	FLASH+SRAM
功能数量：	1	端子数量：	73
字数：	2097152 words	字数代码：	2000000
工作模式：	ASYNCHRONOUS	最高工作温度：	85 °C
最低工作温度：	-40 °C	组织：	2MX16
封装主体材料：	PLASTIC/EPOXY	封装代码：	LFBGA
封装等效代码：	BGA73,10X12,32	封装形状：	RECTANGULAR
封装形式：	GRID ARRAY, LOW PROFILE, FINE PITCH	峰值回流温度（摄氏度）：	NOT SPECIFIED
电源：	3 V	认证状态：	Not Qualified
座面最大高度：	1.4 mm	最大待机电流：	0.000005 A
子类别：	Other Memory ICs	最大压摆率：	0.053 mA
最大供电电压 (Vsup)：	3.3 V	最小供电电压 (Vsup)：	2.7 V
标称供电电压 (Vsup)：	3 V	表面贴装：	YES
技术：	CMOS	温度等级：	INDUSTRIAL
端子面层：	Tin/Lead (Sn/Pb)	端子形式：	BALL
端子节距：	0.8 mm	端子位置：	BOTTOM
处于峰值回流温度下的最长时间：	NOT SPECIFIED	宽度：	8 mm
Base Number Matches：	1

IS71V16F32ES08-7070BI 数据手册

浏览型号IS71V16F32ES08-7070BI的Datasheet PDF文件第2页

浏览型号IS71V16F32ES08-7070BI的Datasheet PDF文件第3页

浏览型号IS71V16F32ES08-7070BI的Datasheet PDF文件第4页

浏览型号IS71V16F32ES08-7070BI的Datasheet PDF文件第5页

浏览型号IS71V16F32ES08-7070BI的Datasheet PDF文件第6页

浏览型号IS71V16F32ES08-7070BI的Datasheet PDF文件第7页

IS71V08F32

IS71V16F32

3.0 Volt-Only Flash & SRAM COMBO with Stacked Multi-Chip

Package (MCP) — 32 Mbit Simultaneous Operation Flash

Memory and 8 Mbit Static RAM

S08

ISSI

PRELIMINARY INFORMATION

MAY 2002

• Ready-Busy output (RY/BY): Detection

of program or erase cycle completion

MCPFEATURES

• Power supply voltage 2.7V to 3.3V

• Over 100,000 write/erase cycles

• High performance:

Flash: 70ns maximum access time

SRAM: 70ns maximum access time

• Low supply voltage (Vccf ≤ 2.5V) inhibits writes

• WP/ACC input pin:

• Package:

If V^IL, allows protection of boot sectors

If VIH, allows removal of boot sector protection

If Vacc, program time is reduced by 40%

73-ball BGA - 32 Mbit Flash/8 Mbit SRAM

• Operating Temperature: -40C to +85C

• Boot sector: Top or Bottom

FLASH FEATURES

SRAM FEATURES (8 Mb density)

• Power Dissipation:

Read Current at 1 Mhz: 7 mA maximum

Read Current at 5 Mhz: 18 mA maximum

Sleep Mode: 5 µA maximum

• PowerDissipation:

Operating: 25 mA maximum

Standby: 15 µA maximum

• Simultaneous Read and Write Operations:

• Chip Selects: CE1s, CE2s

Zero latency between read and write operations; Data

can be programmed or erased in one bank while data

is simultaneously being read from the other bank

• Power down feature using CE1s, or CE2s or LBs & UBs

• Data retention supply voltage: 1.0 to 3.3 volt

• Low-Power Mode:

• Byte data control: LBs (DQ0–DQ7), UBs

A period of no activity causes flash to enter a

low-power state

(DQ8–DQ15)—onx16version

GENERALDESCRIPTION

• Erase Suspend/Resume:

Suspends of erase activity to allow a read in the

same bank

The flash and SRAM MCP is available in 32 Mbit Flash/8

Mbit SRAM having a data bus of either x8 or x16. The 32

Mbit flash is composed of 2,097,152 words of 16 bits or

4,194,304 bytes of 8 bits. Data lines DQ0-DQ7 handle the

x8 format, while lines DQ0-DQ15 handle the x16 format.

• Sector Erase Architecture:

8 words of 4k size and 63 words of 32K size (32 Mbit)

Any combination of sectors, or the entire flash can

be simultaneously erased

The package uses a 3.0V power supply for all operations.

No other source is required for program and erase

operations. The flash can be programmed in system

using this 3.0V supply, or can be programmed in a

standard EPROM programmer.

• Erase Algorithms:

Automatically preprograms/erases the flash

memory entirely, or by sector

• Program Algorithms:

The 32 Mbit flash/8 Mbit SRAM is offered in a 73-pin BGA

package. The flash is compatible with the JEDEC Flash

command set standard . The flash access time is 70 ns

and the SRAM access time is 70ns.

Automatically writes and verifies data at specified

address

• Hidden ROM Region:

64KB with a Factory-serialized secure electronic

serial number (ESN), which is accessible through a

command sequence

The Flash architecture is composed of two banks which

allows simultaneous operation on each. Optimized

performance can be achieved by first initializing a program

or erase function in one bank, then immediately starting a

read from the other bank. Both operations would then be

operating simultaneously, with zero latency.

• Data Polling and Toggle Bit:

Allow for detection of program or erase cycle

completion

ISSIreservestherighttomakechangesthisspecificationhereinanditproductsatanytimewithoutnotice. ISSIassumesnoresponsibilityorliabilityarisingoutoftheapplicationoruseofanyinformation,

productorservicesdescribedherein.Customersareadvisedtoobtainthelatestversionofthisdevicespecificationbeforerelyingonanypublishedinformationandbeforeplacingordersforproducts.

Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774

PRELIMINARYINFORMATION Rev. 00B

05/23/02

12 3 4 5 6 7...48

中文翻译

下载PDF

与IS71V16F32ES08-7070BI相关器件

型号	品牌	获取价格	描述	数据表
IS71V16F32ES08-7085BI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73
IS71V16F32ES08-8570BI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73
IS71V16F32ES08-8585BI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, MINI, BGA-73
IS71V16F32EST08-7070BI	ISSI	获取价格	Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, FBGA-73
IS71V16F32GSB04-7070BI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA59, 7 X 9 MM, 0.80 MM PITCH, FBGA-59
IS71V16F32GSB08-7070BI	ISSI	获取价格	Memory Circuit, 2MX16, CMOS, PBGA73, 8 X 11.60 MM, 0.80 MM PITCH, BGA-73
IS71V16F32GST04-7070BI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 2MX16, CMOS, PBGA59, 7 X 9 MM, 0.80 MM PITCH, FBGA-59
IS71V16F64GS08-7085AI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 4MX16, CMOS, PBGA101, 11 X 12 MM, BGA-101
IS71V16F64GS08-8570AI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 4MX16, CMOS, PBGA101, 11 X 12 MM, BGA-101
IS71V16F64GS08-8570BI	ISSI	获取价格	Memory Circuit, Flash+SRAM, 4MX16, CMOS, PBGA73, 8 X 11.60 MM, BGA-73

与IS71V16F32ES08-7070BI相关文章

SK海力士量产12层HBM3E，容量高达36GB
2024-09-27

11
意法半导体传感器驱动Sphere，开启沉浸式电影新时代
2024-09-27

14
摩尔斯微电子在美国约书亚树国家公园测试 Wi-Fi HaLow
2024-09-18

81
贸泽上架Tallysman TW5386智能GNSS天线
2024-09-18

72

产品中心

服务支持

精选活动

关于我们

帮助中心

IS71V16F32ES08-7070BI

IS71V16F32ES08-7070BI 技术参数

IS71V16F32ES08-7070BI 数据手册

与IS71V16F32ES08-7070BI相关器件

与IS71V16F32ES08-7070BI相关文章

您还可以找

产品中心

服务支持

精选活动

关于我们

帮助中心

IS71V16F32ES08-7070BI

IS71V16F32ES08-7070BI 技术参数

IS71V16F32ES08-7070BI 数据手册

与IS71V16F32ES08-7070BI相关器件

与IS71V16F32ES08-7070BI相关文章

您还可以找

您在本页遇到什么问题？