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IS61LV632A-6PQ PDF预览

IS61LV632A-6PQ

更新时间: 2024-02-22 14:58:19
品牌 Logo 应用领域
美国芯成 - ISSI 存储内存集成电路静态存储器
页数 文件大小 规格书
16页 122K
描述
32K x 32 SYNCHRONOUS FAST STATIC RAM

IS61LV632A-6PQ 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:QFP
包装说明:TQFP-100针数:100
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.85
最长访问时间:6 ns其他特性:SELF-TIMED WRITE CYCLE; POWER DOWN OPTION
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:1048576 bit内存集成电路类型:CACHE SRAM
内存宽度:32功能数量:1
端子数量:100字数:32768 words
字数代码:32000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:32KX32输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装等效代码:QFP100,.63X.87封装形状:RECTANGULAR
封装形式:FLATPACK, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240电源:2.5/3.3,3.3 V
认证状态:Not Qualified座面最大高度:1.6 mm
最大待机电流:0.02 A最小待机电流:3.14 V
子类别:SRAMs最大压摆率:0.17 mA
最大供电电压 (Vsup):3.465 V最小供电电压 (Vsup):3.135 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:30宽度:14 mm
Base Number Matches:1

IS61LV632A-6PQ 数据手册

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®
IS61LV632A  
32K x 32 SYNCHRONOUS FAST STATIC RAM  
ISSI  
APRIL 2001  
FEATURES  
• Fast access time:  
DESCRIPTION  
The ISSI IS61LV632A is a high-speed, low-power synchro-  
nous static RAM designed to provide a burstable, high-  
performance, secondary cache for the i486™, Pentium™,  
680X0™, and PowerPC™ microprocessors. It is organized  
as 32,768 words by 32 bits, fabricated with ISSI's advanced  
CMOStechnology.Thedeviceintegratesa2-bitburstcounter,  
high-speed SRAM core, and high-drive capability outputs into  
asinglemonolithiccircuit.Allsynchronousinputspassthrough  
registers controlled by a positive-edge-triggered single clock  
input.  
– 4 ns-125 MHz; 5 ns-100 MHz;  
6 ns-83 MHz; 7 ns-75 MHz; 8 ns-66 MHz  
• Internal self-timed write cycle  
• Individual Byte Write Control and Global Write  
• Clock controlled, registered address, data and  
control  
• Pentium™ or linear burst sequence control  
using MODE input  
Write cycles are internally self-timed and are initiated by the  
rising edge of the clock input. Write cycles can be from one to  
four bytes wide as controlled by the write control inputs.  
• Three chip enables for simple depth expansion  
and address pipelining  
• Common data inputs and data outputs  
• Power-down control by ZZ input  
Separate byte enables allow individual bytes to be written.  
BW1 controls DQ1-DQ8, BW2 controls DQ9-DQ16, BW3  
controlsDQ17-DQ24,BW4controlsDQ25-DQ32,conditioned  
byBWEbeingLOW.ALOWonGWinputwouldcauseallbytes  
to be written.  
• JEDEC 100-Pin TQFP and PQFP package  
• 3.3V Vcc and 2.5V VCCQ for 2.5V I/Os  
• Two Clock enables and one Clock disable to  
eliminate multiple bank bus contention.  
Bursts can be initiated with either ADSP (Address Status  
Processor) or ADSC (Address Status Cache Controller) input  
pins. Subsequent burst addresses can be generated inter-  
nally by the IS61LV632A and controlled by the ADV (burst  
address advance) input pin.  
• Control pins mode upon power-up:  
– MODE in interleave burst mode  
– ZZ in normal operation mode  
These control pins can be connected to GNDQ  
or VCCQ to alter their power-up state  
Asynchronoussignalsincludeoutputenable(OE),sleepmode  
input(ZZ), clock(CLK)andburstmodeinput(MODE). AHIGH  
input on the ZZ pin puts the SRAM in the power-down state.  
When ZZ is pulled LOW (or no connect), the SRAM normally  
operates after three cycles of the wake-up period. A LOW  
input, i.e., GNDQ, on MODE pin selects LINEAR Burst. A VCCQ  
(or no connect) on MODE pin selects INTERLEAVED Burst.  
ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any  
errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
Rev. A  
1
04/17/01  

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