IS43/46TR16256A, IS43/46TR16256AL,
IS43/46TR85120A, IS43/46TR85120AL
512Mx8, 256Mx16 4Gb DDR3 SDRAM
ADVANCED INFORMATION
NOVEMBER 2012
FEATURES
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Standard Voltage: VDD and VDDQ = 1.5V ± 0.075V
Low Voltage (L): VDD and VDDQ = 1.35V + 0.1V, -0.067V
•
Refresh Interval:
7.8 us (8192 cycles/64 ms) Tc= -40°C to 85°C
3.9 us (8192 cycles/32 ms) Tc= 85°C to 105°C
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High speed data transfer rates with system
frequency up to 933 MHz
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Partial Array Self Refresh
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8 internal banks for concurrent operation
8n-Bit pre-fetch architecture
Asynchronous RESET pin
TDQS (Termination Data Strobe) supported (x8
only)
Programmable CAS Latency
Programmable Additive Latency: 0, CL-1,CL-2
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OCD (Off-Chip Driver Impedance Adjustment)
Dynamic ODT (On-Die Termination)
Driver strength : RZQ/7, RZQ/6 (RZQ = 240 ©)
Write Leveling
Programmable CAS WRITE latency (CWL) based
on tCK
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Programmable Burst Length: 4 and 8
Programmable Burst Sequence: Sequential or
Interleave
Operating temperature:
Commercial (TC = 0°C to +95°C)
Industrial (TC = -40°C to +95°C)
Automotive, A1 (TC = -40°C to +95°C)
Automotive, A2 (TC = -40°C to +105°C)
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BL switch on the fly
Auto Self Refresh(ASR)
Self Refresh Temperature(SRT)
ADDRESS TABLE
Parameter
OPTIONS
512Mx8
A0-A15
A0-A9
BA0-2
1KB
256Mx16
A0-A14
A0-A9
BA0-2
2KB
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Configuration:
Row Addressing
Column Addressing
Bank Addressing
512Mx8
256Mx16
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Package:
Page size
Auto Precharge
Addressing
96-ball FBGA (9mm x 13mm) for x16
78-ball FBGA (9mm x 10.5mm) for x8
A10/AP
A10/AP
BL switch on the fly
A12/BC#
A12/BC#
SPEED BIN
Speed Option
187F
15H
125K
107M
Units
JEDEC Speed Grade
DDR3-1066F
DDR3-1333H
DDR3-1600K
DDR3-1866M
CL-nRCD-nRP
tRCD,tRP(min)
Note:
7-7-7
13.125
9-9-9
13.125
11-11-11
13.125
13-13-13
13.91
tCK
ns
Faster speed options are backward compatible to slower speed options.
Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised
to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product
can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use
in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc. – www.issi.com –
1
Rev. 00A
11/14/2012