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IS43R32400A-6BLI-TR PDF预览

IS43R32400A-6BLI-TR

更新时间: 2024-11-25 13:02:15
品牌 Logo 应用领域
美国芯成 - ISSI 动态存储器双倍数据速率
页数 文件大小 规格书
25页 1286K
描述
DRAM

IS43R32400A-6BLI-TR 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:compliant风险等级:5.75
Base Number Matches:1

IS43R32400A-6BLI-TR 数据手册

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®
IS43R32400A  
ISSI  
PRELIMINARY INFORMATION  
FEBRUARY 2006  
4Meg x 32  
128-MBIT DDR SDRAM  
FEATURES  
DEVICE OVERVIEW  
ISSI’s 128-Mbit DDR SDRAM achieves high-speed  
data transfer using pipeline architecture and two data  
word accesses per clock cycle. The 134,217,728-bit  
memory array is internally organized as four banks of  
32M-bit to allow concurrent operations. The pipeline  
allows Read and Write burst accesses to be virtually  
continuous, with the option to concatenate or truncate  
the bursts. The programmable features of burst  
length, burst sequence and CAS latency enable  
further advantages. The device is available in 32-bit  
data word size. Input data is registered on the I/O pins  
on both edges of Data Strobe signal(s), while output  
data is referenced to both edges of Data Strobe and  
both edges of CLK. Commands are registered on the  
positive edges of CLK. Auto Refresh, Active Power  
Down, and Pre-charge Power Down modes are  
enabled by using clock enable (CKE) and other inputs  
in an industry-standard sequence. All input and  
output voltage levels are compatible with SSTL 2.  
Clock Frequency: 200, 166, 100 MHz  
Power supply (VDD and VDDQ): 2.5V  
SSTL 2 interface  
Four internal banks to hide row Pre-charge  
and Active operations  
Commands and addresses register on positive  
clock edges (CLK)  
Bi-directional Data Strobe signal for data cap-  
ture  
Differential clock inputs (CLK and CLK) for  
two data accesses per clock cycle  
Data Mask feature for Writes supported  
DLL aligns data I/O and Data Strobe transitions  
with clock inputs  
Half-strength and Matched drive strength  
options  
IS43R32400A  
1M x32x4 Banks  
VDD: 2.5V  
Programmable burst length for Read and Write  
operations  
Programmable CAS Latency (3, 4, 5 clocks)  
VDDQ: 2.5V  
Programmable burst sequence: sequential or  
144-ballBGA  
interleaved  
Burst concatenation and truncation supported  
for maximum data throughput  
KEY TIMING PARAMETERS  
Auto Pre-charge option for each Read or Write  
burst  
Parameter  
-5  
-6  
Unit  
CLK Cycle Time (min.)  
CAS Latency = 5  
4096 refresh cycles every 32ms  
Auto Refresh and Self Refresh Modes  
5
5
5
6
6
6
ns  
ns  
ns  
CAS Latency = 4  
Pre-charge Power Down and Active Power  
CAS Latency = 3  
Down Modes  
CLK Frequency (max.)  
CAS Latency = 5  
Industrial Temperature Availability  
Lead-free Availability  
200  
200  
200  
166  
166  
166  
MHz  
MHz  
MHz  
CAS Latency = 4  
CAS Latency = 3  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time  
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to  
obtain the latest version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — 1-800-379-4774  
1
Rev. 00D  
02/15/06  

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