IS43R16800CC
8Mx16
128Mb DDR Synchronous DRAM
JUNE 2009
FEATURES:
•ꢀ Vd d =Vd d q = 2.5V+0.2V (-5, -6, -75)
•ꢀ Double data rate architecture; two data transfers
per clock cycle.
•ꢀ Bidirectional , data strobe (DQS) is transmitted/
received with data
•ꢀ Differential clock input (CLK and /CLK)
DESCRIPTION:
IS43R16800CC is a 4-bank x 2,097,152-word x 16bit
double data rate synchronous DRAM , with SSTL_2
interface. All control and address signals are referenced
to the rising edge of CLK. Input data is registered on
both edges of data strobe, and output data and data
strobe are referenced on both edges of CLK. The device
achieves very high speed clock rate up to 200 MHz.
•ꢀ DLL aligns DQ and DQS transitions with CLK
transitions edges of DQS
•ꢀ Commands entered on each positive CLK edge;
•ꢀ Data and data mask referenced to both edges of
KEY TIMING PARAMETERS
Parameter
-5
-6
-75 Unit
DQS
Clk Cycle Time
•ꢀ 4 bank operation controlled by BA0 , BA1
CAS Latency = 3
CAS Latency = 2.5
CAS Latency = 2
5
5
7.5
6
6
7.5
7.5
7.5
7.5
ns
ns
ns
(Bank Address)
•ꢀ /CAS latency -2.0 / 2.5 / 3.0 (programmable) ;
Burst length -2 / 4 / 8 (programmable)
Burst type -Sequential / Interleave (program-
mable)
Clk Frequency
CAS Latency = 3
CAS Latency = 2.5
CAS Latency = 2
200
200
133
167
167
133
133 MHz
133 MHz
133 MHz
•ꢀ Auto precharge/ All bank precharge controlled
by A10
Access Time from Clock
CAS Latency = 3
•ꢀ 4096 refresh cycles / 64ms (4 banks concurrent
+0.70 +0.70 +0.75 ns
refresh)
CAS Latency = 2.5 +0.70 +0.70 +0.75 ns
CAS Latency = 2 +0.75 +0.75 +0.75 ns
•ꢀ Auto refresh and Self refresh
•ꢀ Row address A0-11 / Column address A0-8
•ꢀ SSTL_2 Interface
•ꢀ Package:
66-pin TSOP II
•ꢀ Temperature Range:
Commercial (0oC to +70oC)
Industrial (-40oC to +85oC)
ADDRESS TABLE
Parameter
8M x 16
Configuration
Bank Address Pins
2M x 16 x 4 banks
BA0, BA1
Autoprecharge Pins
Row Addresses
Column Addresses
Refresh Count
A10/AP
A0 – A11
A0 – A8
4096 / 64ms
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the
latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc.
1
Rev. A
06/01/09