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IS42S16160C-6TLI PDF预览

IS42S16160C-6TLI

更新时间: 2024-01-30 07:11:25
品牌 Logo 应用领域
美国芯成 - ISSI 动态存储器
页数 文件大小 规格书
40页 1540K
描述
256 Mb Single Data Rate Synchronous DRAM

IS42S16160C-6TLI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSOP54,.46,32针数:54
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.14
访问模式:FOUR BANK PAGE BURST最长访问时间:5.4 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):166 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G54JESD-609代码:e3
长度:22.22 mm内存密度:268435456 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
湿度敏感等级:3功能数量:1
端口数量:1端子数量:54
字数:16777216 words字数代码:16000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:16MX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP54,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:1.2 mm自我刷新:YES
连续突发长度:1,2,4,8,FP最大待机电流:0.005 A
子类别:DRAMs最大压摆率:0.21 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn)端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:10.16 mm
Base Number Matches:1

IS42S16160C-6TLI 数据手册

 浏览型号IS42S16160C-6TLI的Datasheet PDF文件第2页浏览型号IS42S16160C-6TLI的Datasheet PDF文件第3页浏览型号IS42S16160C-6TLI的Datasheet PDF文件第4页浏览型号IS42S16160C-6TLI的Datasheet PDF文件第5页浏览型号IS42S16160C-6TLI的Datasheet PDF文件第6页浏览型号IS42S16160C-6TLI的Datasheet PDF文件第7页 
IS42S83200C  
IS42S16160C  
256 Mb Single Data Rate Synchronous DRAM  
APRIL 2009  
General Description  
IS42S83200C is organized as 4-bank x 8,388,608-word x 8-bit Synchronous DRAM with LVTTL interface and  
IS42S16160C is organized as 4-bank x 4,194,304-word x 16-bit. All inputs and outputs are referenced to  
the rising edge of CLK. IS42S83200C and IS42S16160C achieve very high speed data rates up to 166MHz, and  
are suitable for main memories or graphic memories in computer systems.  
Features  
- Single 3.3V ±0.3V power supply  
- Max. Clock frequency :  
- 6:166MHz<3-3-3>/-7:143MHz<3-3-3>/-75:133MHz<3-3-3>  
- Fully synchronous operation referenced to clock rising edge  
- 4-bank operation controlled by BA0,BA1(Bank Address)  
- /CAS latency- 2/3 (programmable)  
- Burst length- 1/2/4/8/FP (programmable)  
- Burst type- Sequential and interleave burst (programmable)  
- Byte Control- LDQM and UDQM (IS42S16160C)  
- Random column access  
- Auto precharge / All bank precharge controlled by A10  
- Auto and self refresh  
- 8192 refresh cycles /64ms  
- LVTTL Interface  
- Package  
400-mil, 54-pin Thin Small Outline (TSOP II) with 0.8mm lead pitch  
Pb-free package is available  
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without  
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the lat-  
est version of this device specification before relying on any published information and before placing orders for products.  
Integrated Silicon Solution, Inc. — www.issi.com  
1
Rev. C  
04/02/09  

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