IS42S83200D, IS42S16160D
IS45S83200D, IS45S16160D
32Meg x 8, 16Meg x16
JUNE 2009
256-MBIT SYNCHRONOUS DRAM
OVERVIEW
FEATURES
ISSI'sꢀ256MbꢀSynchronousꢀDRAMꢀꢀachievesꢀhigh-speedꢀ
data transfer using pipeline architecture. All inputs and
outputs signals refer to the rising edge of the clock input.
Theꢀ256MbꢀSDRAMꢀisꢀorganizedꢀasꢀfollows.ꢀ
•ꢀ Clockꢀfrequency:ꢀ166,ꢀ143ꢀꢀMHz
•ꢀ Fullyꢀsynchronous;ꢀallꢀsignalsꢀreferencedꢀtoꢀaꢀ
positive clock edge
•ꢀ Internalꢀbankꢀforꢀhidingꢀrowꢀaccess/precharge
•ꢀ SingleꢀPowerꢀsupply:ꢀ3.3Vꢀ+ꢀ0.3Vꢀ
•ꢀ LVTTLꢀinterface
IS42S83200Dꢀ
IS42S16160Dꢀ
8Mꢀxꢀ8ꢀxꢀ4ꢀBanksꢀ 4Mꢀx16x4ꢀBanksꢀ
54-pinꢀTSOPIIꢀ
54-pinꢀTSOPII
•ꢀ Programmableꢀburstꢀlengthꢀ
–ꢀ(1,ꢀ2,ꢀ4,ꢀ8,ꢀfullꢀpage)
ꢀ
ꢀ
54-ballꢀBGAꢀ(contactꢀMarketing)ꢀ
•ꢀ Programmableꢀburstꢀsequence:ꢀ
Sequential/Interleaveꢀ
KEY TIMING PARAMETERS
•ꢀ AutoꢀRefreshꢀ(CBR)
•ꢀ SelfꢀRefresh
Parameter
-6
-7
-75E Unit
ClkꢀCycleꢀTimeꢀ
CASꢀLatencyꢀ=ꢀ3ꢀ
CASꢀLatencyꢀ=ꢀ2ꢀ
ꢀꢀ
6ꢀ
10ꢀ
ꢀ
ꢀ
ꢀ
•ꢀ 8Kꢀrefreshꢀcyclesꢀeveryꢀ16ꢀmsꢀ(A2ꢀgrade)ꢀorꢀ
64ꢀmsꢀ(commercial,ꢀindustrial,ꢀA1ꢀgrade)
7ꢀ
10ꢀ
—ꢀ
7.5ꢀ
nsꢀ
ns
ClkꢀFrequencyꢀ
CASꢀLatencyꢀ=ꢀ3ꢀ
CASꢀLatencyꢀ=ꢀ2ꢀ
ꢀꢀ
166ꢀ
100ꢀ
ꢀ
ꢀ
ꢀ
•ꢀ Randomꢀcolumnꢀaddressꢀeveryꢀclockꢀcycle
143ꢀ
100ꢀ
—ꢀ
133ꢀ
Mhzꢀ
Mhz
•ꢀ ProgrammableꢀCASꢀlatencyꢀ(2,ꢀ3ꢀclocks)
•ꢀ Burstꢀread/writeꢀandꢀburstꢀread/singleꢀwriteꢀ
AccessꢀTimeꢀꢀfromꢀClockꢀ
CASꢀLatencyꢀ=ꢀ3ꢀ
CASꢀLatencyꢀ=ꢀ2ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
5.4ꢀ
6.5ꢀ
5.4ꢀ
6.5ꢀ
—ꢀ
5.5ꢀ
nsꢀ
ns
operations capability
•ꢀ Burstꢀterminationꢀbyꢀburstꢀstopꢀandꢀprechargeꢀ
command
OPTIONS
•ꢀ Package:
ADDRESS TABLE
Parameter
32M x 8
16M x 16
54-pinꢀTSOP-IIꢀ(x8ꢀandꢀx16)
54-ballꢀBGAꢀ(x16ꢀonly)
Configuration
8M x 8 x 4
banks
4M x 16 x 4
banks
•ꢀ OperatingꢀTemperatureꢀRange:
Commercial (0oC to +70oC)
Refresh Count
Com./Ind. 8K/64ms
A1 8K/64ms
8K/64ms
8K/64ms
8K/16ms
Industrialꢀ(-40oCꢀtoꢀ+85oC)
AutomotiveꢀGradeꢀA1ꢀ(-40oCꢀtoꢀ+85oC)
AutomotiveꢀGradeꢀA2ꢀ(-40oC to +105oC)
A2 8K/16ms
Row Addresses
A0-A12
A0-A12
A0-A8
Column Addresses
Bank Address Pins
Auto Precharge Pins
A0-A9
•ꢀ DieꢀRevision:ꢀD
BA0, BA1
A10/AP
BA0, BA1
A10/AP
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time with-
out notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain
the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com
1
Rev. B
06/11/09