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IRLR3715ZCPBF PDF预览

IRLR3715ZCPBF

更新时间: 2024-11-27 03:09:15
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
11页 294K
描述
HEXFET Power MOSFET

IRLR3715ZCPBF 数据手册

 浏览型号IRLR3715ZCPBF的Datasheet PDF文件第2页浏览型号IRLR3715ZCPBF的Datasheet PDF文件第3页浏览型号IRLR3715ZCPBF的Datasheet PDF文件第4页浏览型号IRLR3715ZCPBF的Datasheet PDF文件第5页浏览型号IRLR3715ZCPBF的Datasheet PDF文件第6页浏览型号IRLR3715ZCPBF的Datasheet PDF文件第7页 
PD - 96053  
IRLR3715ZCPbF  
IRLU3715ZCPbF  
HEXFET® Power MOSFET  
Applications  
l High Frequency Synchronous Buck  
Converters for Computer Processor Power  
l High Frequency Isolated DC-DC  
Converters with Synchronous Rectification  
for Telecom and Industrial Use  
VDSS RDS(on) max  
Qg  
7.2nC  
11m  
20V  
l Lead-Free  
Benefits  
l Ultra-Low Gate Impedance  
l Fully Characterized Avalanche Voltage  
and Current  
D-Pak  
I-Pak  
IRLR3715ZCPbF IRLU3715ZCPbF  
Absolute Maximum Ratings  
Parameter  
Drain-to-Source Voltage  
Max.  
20  
Units  
V
VDS  
V
Gate-to-Source Voltage  
± 20  
49  
GS  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
I
I
I
@ TC = 25°C  
A
D
D
35  
@ TC = 100°C  
200  
40  
DM  
P
P
@TC = 25°C  
@TC = 100°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
W
D
D
20  
Linear Derating Factor  
Operating Junction and  
0.27  
W/°C  
°C  
T
-55 to + 175  
J
T
Storage Temperature Range  
STG  
Soldering Temperature, for 10 seconds  
300 (1.6mm from case)  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
–––  
Max.  
3.75  
50  
Units  
Rθ  
Rθ  
Rθ  
Junction-to-Case  
°C/W  
JC  
JA  
JA  
Junction-to-Ambient (PCB Mount)  
Junction-to-Ambient  
110  
Notes  through are on page 11  
www.irf.com  
1
02/23/06  

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