PD - 96360
IRLHS2242PbF
HEXFET® Power MOSFET
VDS
-20
12
V
V
TOP VIEW
VGS max
±
RDS(on) max
(@VGS = 4.5V)
31
m
Ω
Ω
D
D
D
1
2
6
5
4
D
D
S
D
G
D
RDS(on) max
(@VGS = 2.5V)
Qg typ
D
53
m
D
D
S
S
9.6
S
nC
A
G 3
2mm x 2mm PQFN
ID
-8.5
(@Tc(Bottom) = 25°C)
Applications
l Charge and Discharge Switch for Battery Application
l System/load switch
Features and Benefits
Features
Benefits
Low Thermal Resistance to PCB (≤ 13°C/W)
Low Profile (≤ 1.0mm)
Enable better thermal dissipation
results in Increased Power Density
⇒
Industry-Standard Pinout
Multi-Vendor Compatibility
Easier Manufacturing
Environmentally Friendlier
Increased Reliability
Compatible with Existing Surface Mount Techniques
RoHS Compliant Containing no Lead, no Bromide and no Halogen
MSL1, Consumer Qualification
Orderable part number
Package Type
Standard Pack
Note
Form
Tape and Reel
Tape and Reel
Quantity
4000
IRLHS2242TRPBF
IRLHS2242TR2PBF
PQFN 2mm x 2mm
PQFN 2mm x 2mm
400
Absolute Maximum Ratings
Parameter
Max.
Units
VDS
Drain-to-Source Voltage
Gate-to-Source Voltage
-20
±12
-7.2
-5.8
V
V
GS
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
Continuous Drain Current, VGS @ 4.5V
I
I
I
I
I
I
@ TA = 25°C
D
D
D
D
D
@ TA = 70°C
-15
-9.8
-8.5
@ TC(Bottom) = 25°C
@ TC(Bottom) = 100°C
@ TC = 25°C
A
Continuous Drain Current, VGS @ 4.5V (Wirebond Limited)
Pulsed Drain Current
-34
2.1
9.6
DM
Power Dissipation
P
P
@TA = 25°C
D
D
W
Power Dissipation
@TC(Bottom) = 25°C
Linear Derating Factor
Operating Junction and
0.02
-55 to + 150
W/°C
°C
T
J
T
Storage Temperature Range
STG
Notes through are on page 9
www.irf.com
1
03/18/11