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IRLI2203G

更新时间: 2024-11-15 22:23:47
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
8页 292K
描述
Power MOSFET(Vdss=30V, Rds(on)=0.010ohm, Id=52A)

IRLI2203G 数据手册

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Previous Datasheet  
Index  
Next Data Sheet  
PD - 9.1092A  
IRLI2203G  
HEXFET® Power MOSFET  
Advanced Process Technology  
Ultra Low On-Resistance  
Isolated Package  
High Voltage Isolation = 2.5KVRMS  
Sink to Lead Creepage Dist. = 4.8mm  
Logic-Level Gate Drive  
VDSS = 30V  
RDS(on) = 0.010Ω  
ID = 52A  
RDS(on) Specified at VGS=5.0V & 10V  
Description  
Fourth Generation HEXFETs from International Rectifier utilize advanced  
processing techniques to achieve the lowest possible on-resistance per silicon  
area. This benefit, combined with the fast switching speed and ruggedized device  
design that HEXFET Power MOSFETs are well known for, provides the designer  
with an extremely efficient device for use in a wide variety of applications.  
The TO-220 Fullpak eliminates the need for additional insulating hardware in  
commercial-industrial applications. The moulding compound used provides a  
high isolation capability and a low thermal resistance between the tab and external  
heatsink. This isolation is equivalent to using a 100 micron mica barrier with  
standard TO-220 product. The Fullpak is mounted to a heatsink using a single clip  
or by a single screw fixing.  
Absolute Maximum Ratings  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Collector Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
52  
37  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
A
210  
PD @TC = 25°C  
Power Dissipation  
48  
W
W/°C  
V
Linear Derating Factor  
0.32  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
±20  
Single Pulse Avalanche Energy  
Avalanche Current  
90  
mJ  
A
31  
4.8  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
Operating Junction and  
mJ  
V/ns  
4.5  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
Mounting torque, 6-32 or M3 screw.  
°C  
300 (1.6mm from case)  
10 lbf•in (1.1N•m)  
Thermal Resistance  
Parameter  
Junction-to-Case  
Junction-to-Ambient  
Min.  
––––  
––––  
Typ.  
––––  
––––  
Max.  
3.1  
Units  
RθJC  
RθJA  
°C/W  
65  
Revision 1  
To Order  
 
 

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