IRFR9310, IRFU9310, SiHFR9310, SiHFU9310
Power MOSFET
FEATURES
• P-Channel
• Surface Mount (IRFR9310/SiHFR9310)
• Straight Lead (IRFU9310/SiHFU9310)
• Advanced Process Technology
• Fast Switching
• Fully Avalanche Rated
• Lead (Pb)-free Available
PRODUCT SUMMARY
VDS (V)
- 400
Available
RDS(on) (Ω)
VGS = - 10 V
7.0
RoHS*
Qg (Max.) (nC)
13
3.2
COMPLIANT
Q
Q
gs (nC)
gd (nC)
5.0
Configuration
Single
DESCRIPTION
S
Third generation Power MOSFETs from Vishay utilize
advanced processing techniques to achieve low
on-resistance per silicon area. This benefit, combined with
the fast switching speed and ruggedized device design that
Power MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use in a
wide variety of applications.
D PAK
(TO-252)
IPAK
(TO-251)
G
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surface mount applications.
D
P-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR9310PbF
SiHFR9310-E3
IRFR9310
DPAK (TO-252)
IRFR9310TRLPbFa
SiHFR9310TL-E3a
IRFR9310TRLa
SiHFR9310TLa
DPAK (TO-252)
IRFR9310TRPbFa
SiHFR9310T-E3a
IRFR9310TRa
DPAK (TO-252)
IRFR9310TRRPbFa
SiHFR9310TR-E3a
IPAK (TO-251)
IRFU9310PbF
SiHFU9310-E3
IRFU9310
Lead (Pb)-free
-
-
SnPb
SiHFR9310
SiHFR9310Ta
SiHFU9310
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
- 400
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
TC = 25 °C
TC =100°C
- 1.8
- 1.1
- 7.2
0.40
Continuous Drain Current
VGS at - 10 V
ID
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
92
- 1.8
5.0
EAR
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
50
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
- 24
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 57 mH, RG = 25 Ω, IAS = - 1.8 A (see fig. 12).
c. ISD ≤ - 1.1 A, dI/dt ≤ 450 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
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