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IRFU9310 PDF预览

IRFU9310

更新时间: 2024-11-09 12:05:07
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲
页数 文件大小 规格书
7页 3346K
描述
Power MOSFET

IRFU9310 数据手册

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IRFR9310, IRFU9310, SiHFR9310, SiHFU9310  
Power MOSFET  
FEATURES  
• P-Channel  
• Surface Mount (IRFR9310/SiHFR9310)  
• Straight Lead (IRFU9310/SiHFU9310)  
• Advanced Process Technology  
• Fast Switching  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
PRODUCT SUMMARY  
VDS (V)  
- 400  
Available  
RDS(on) (Ω)  
VGS = - 10 V  
7.0  
RoHS*  
Qg (Max.) (nC)  
13  
3.2  
COMPLIANT  
Q
Q
gs (nC)  
gd (nC)  
5.0  
Configuration  
Single  
DESCRIPTION  
S
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
D PAK  
(TO-252)  
IPAK  
(TO-251)  
G
The DPAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFU/SiHFU series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surface mount applications.  
D
P-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFR9310PbF  
SiHFR9310-E3  
IRFR9310  
DPAK (TO-252)  
IRFR9310TRLPbFa  
SiHFR9310TL-E3a  
IRFR9310TRLa  
SiHFR9310TLa  
DPAK (TO-252)  
IRFR9310TRPbFa  
SiHFR9310T-E3a  
IRFR9310TRa  
DPAK (TO-252)  
IRFR9310TRRPbFa  
SiHFR9310TR-E3a  
IPAK (TO-251)  
IRFU9310PbF  
SiHFU9310-E3  
IRFU9310  
Lead (Pb)-free  
-
-
SnPb  
SiHFR9310  
SiHFR9310Ta  
SiHFU9310  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
- 400  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
TC =100°C  
- 1.8  
- 1.1  
- 7.2  
0.40  
Continuous Drain Current  
VGS at - 10 V  
ID  
A
Pulsed Drain Currenta  
IDM  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
92  
- 1.8  
5.0  
EAR  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
50  
Peak Diode Recovery dV/dtc  
dV/dt  
TJ, Tstg  
- 24  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
- 55 to + 150  
300d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 57 mH, RG = 25 Ω, IAS = - 1.8 A (see fig. 12).  
c. ISD - 1.1 A, dI/dt 450 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
www.kersemi.com  
1

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