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IRFUC20 PDF预览

IRFUC20

更新时间: 2024-09-14 12:04:59
品牌 Logo 应用领域
科盛美 - KERSEMI 晶体晶体管开关脉冲
页数 文件大小 规格书
7页 4340K
描述
Power MOSFET

IRFUC20 数据手册

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IRFRC20, IRFUC20, SiHFRC20, SiHFUC20  
Power MOSFET  
FEATURES  
• Dynamic dV/dt Rating  
PRODUCT SUMMARY  
VDS (V)  
600  
Available  
• Repetitive Avalanche Rated  
RoHS*  
• Surface Mount (IRFRC20/SiHFRC20)  
COMPLIANT  
RDS(on) (Ω)  
VGS = 10 V  
4.4  
Qg (Max.) (nC)  
18  
3.0  
• Straight Lead (IRFUC20/SiHFUC20)  
• Available in Tape and Reel  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
8.9  
Configuration  
Single  
• Ease of Paralleling  
• Lead (Pb)-free Available  
D
DPAK  
(TO-252)  
IPAK  
(TO-251)  
DESCRIPTION  
Third generation Power MOSFETs from Vishay provide the  
designer with the best combination of fast switching,  
ruggedized device design, low on-resistance and  
cost-effectiveness.  
G
The D PAK is designed for surface mounting using vapor  
phase, infrared, or wave soldering techniques. The straight  
lead version (IRFUC/SiHFUC series) is for through-hole  
mounting applications. Power dissipation levels up to 1.5 W  
are possible in typical surcace mount applications.  
S
N-Channel MOSFET  
ORDERING INFORMATION  
Package  
DPAK (TO-252)  
IRFRC20PbF  
SiHFRC20-E3  
IRFRC20  
DPAK (TO-252)  
IRFRC20TRLPbFa  
SiHFRC20TL-E3a  
IRFRC20TRLa  
DPAK (TO-252)  
IRFRC20TRPbFa  
SiHFRC20T-E3a  
IRFRC20TRa  
DPAK (TO-252)  
IRFRC20TRRPbFa  
SiHFRC20TR-E3a  
IRFRC20TRRa  
IPAK (TO-251)  
IRFUC20PbF  
SiHFUC20-E3  
IRFUC20  
Lead (Pb)-free  
SnPb  
SiHFRC20  
SiHFRC20TLa  
SiHFRC20Ta  
SiHFRC20TRa  
SiHFUC20  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
600  
20  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
V
VGS  
TC = 25 °C  
TC =100°C  
2.0  
Continuous Drain Current  
V
GS at 10 V  
ID  
1.3  
A
Pulsed Drain Currenta  
IDM  
8.0  
Linear Derating Factor  
0.33  
0.020  
450  
2.0  
W/°C  
Linear Derating Factor (PCB Mount)e  
Single Pulse Avalanche Energyb  
Repetitive Avalanche Currenta  
EAS  
IAR  
mJ  
A
Repetitive Avalanche Energya  
EAR  
4.2  
mJ  
Maximum Power Dissipation  
Maximum Power Dissipation (PCB Mount)e  
Peak Diode Recovery dV/dtc  
TC = 25 °C  
42  
PD  
W
V/ns  
°C  
TA = 25 °C  
2.5  
dV/dt  
3.0  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 150  
260d  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = 50 V, starting TJ = 25 °C, L = 206 mH, RG = 25 Ω, IAS = 2.0 A (see fig. 12).  
c. ISD 2.0 A, dI/dt 40 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. When mounted on 1" square PCB (FR-4 or G-10 material).  
www.kersemi.com  
1

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