IRFR9110, IRFU9110, SiHFR9110, SiHFU9110
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
- 100
Available
• Repetitive Avalanche Rated
RDS(on) (Ω)
VGS = - 10 V
1.2
RoHS*
• Surface Mount (IRFR9110/SiHFR9110)
COMPLIANT
Qg (Max.) (nC)
8.7
• Straight Lead (IRFU9110/SiHFU9110)
Q
gs (nC)
2.2
• Available in Tape and Reel
Qgd (nC)
4.1
• P-Channel
Configuration
Single
• Fast Switching
• Lead (Pb)-free Available
S
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effictiveness.
G
The DPAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFU/SiHFU Series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surcace mount applications.
D
P-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
DPAK (TO-252)
DPAK (TO-252)
IRFR9110TRPbFa
SiHFR9110T-E3a
IRFR9110TRa
IPAK (TO-251)
IRFU9110PbF
SiHFU9110-E3
IRFU9110
IRFR9110PbF
SiHFR9110-E3
IRFR9110
IRFR9110TRLPbFa
SiHFR9110TL-E3a
IRFR9110TRLa
Lead (Pb)-free
SnPb
SiHFR9110
SiHFR9110TLa
SiHFR9110Ta
SiHFU9110
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
- 100
20
V
VGS
TC = 25 °C
TC =100°C
- 3.1
- 2.0
- 12
Continuous Drain Current
V
GS at - 10 V
ID
A
Pulsed Drain Currenta
IDM
Linear Derating Factor
0.20
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
0.020
140
EAS
IAR
mJ
A
- 3.1
2.5
Repetitive Avalanche Energya
EAR
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
25
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
- 5.5
- 55 to + 150
260d
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = - 25 V, starting TJ = 25 °C, L = 21 mH, RG = 25 Ω, IAS = - 3.1 A (see fig. 12).
c. ISD ≤ - 4.0 A, dI/dt ≤ 75 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
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