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IRFR9120N PDF预览

IRFR9120N

更新时间: 2024-11-05 22:32:07
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
10页 119K
描述
Power MOSFET(Vdss=-100V, Rds(on)=0.48ohm, Id=-6.6A)

IRFR9120N 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SMALL OUTLINE, R-PSSO-G2Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:5.1Is Samacsys:N
其他特性:AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE雪崩能效等级(Eas):100 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (ID):6.6 A
最大漏源导通电阻:0.48 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-252AAJESD-30 代码:R-PSSO-G2
JESD-609代码:e0湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):245
极性/信道类型:P-CHANNEL最大脉冲漏极电流 (IDM):26 A
认证状态:Not Qualified表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:30
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRFR9120N 数据手册

 浏览型号IRFR9120N的Datasheet PDF文件第2页浏览型号IRFR9120N的Datasheet PDF文件第3页浏览型号IRFR9120N的Datasheet PDF文件第4页浏览型号IRFR9120N的Datasheet PDF文件第5页浏览型号IRFR9120N的Datasheet PDF文件第6页浏览型号IRFR9120N的Datasheet PDF文件第7页 
PD - 9.1507A  
IRFR/U9120N  
PRELIMINARY  
HEXFET® Power MOSFET  
l Ultra Low On-Resistance  
l P-Channel  
l Surface Mount (IRFR9120N)  
l Straight Lead (IRFU9120N)  
l Advanced Process Technology  
l Fast Switching  
D
VDSS = -100V  
RDS(on) = 0.48Ω  
G
ID = -6.6A  
l Fully Avalanche Rated  
S
Description  
Fifth Generation HEXFETs from International Rectifier  
utilize advanced processing techniques to achieve  
extremely low on-resistance per silicon area. This benefit,  
combined with the fast switching speed and ruggedized  
device design that HEXFET Power MOSFETs are well  
knownfor, providesthedesignerwithanextremelyefficient  
and reliable device for use in a wide variety of applications.  
D -Pak  
I-Pak  
TO -252AA  
TO -251AA  
The D-Pak is designed for surface mounting using vapor  
phase, infrared, orwavesolderingtechniques. Thestraight  
lead version (IRFU series) is for through-hole mounting  
applications. Power dissipation levels up to 1.5 watts are  
possible in typical surface mount applications.  
Absolute Maximum Ratings  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
Continuous Drain Current, VGS @ -10V  
Continuous Drain Current, VGS @ -10V  
Pulsed Drain Current   
-6.6  
-4.2  
-26  
A
PD @TC = 25°C  
Power Dissipation  
40  
W
W/°C  
V
Linear Derating Factor  
0.32  
± 20  
100  
-6.6  
4.0  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy‚  
Avalanche Current  
mJ  
A
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt ƒ  
Operating Junction and  
mJ  
-5.0  
V/ns  
-55 to + 150  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
°C  
300 (1.6mm from case )  
Thermal Resistance  
Parameter  
Junction-to-Case  
Typ.  
–––  
–––  
–––  
Max.  
3.1  
50  
Units  
RθJC  
RθJA  
RθJA  
Junction-to-Ambient (PCB mount)**  
Junction-to-Ambient  
°C/W  
110  
3/16/98  

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