IRFR430A, IRFU430A, SiHFR430A, SiHFU430A
Power MOSFET
FEATURES
• Low Gate Charge Qg Results in Simple Drive
Requirement
PRODUCT SUMMARY
VDS (V)
500
Available
RDS(on) (Ω)
VGS = 10 V
1.7
RoHS*
• Improved Gate, Avalanche and Dynamic dV/dt
Ruggedness
Qg (Max.) (nC)
24
6.5
COMPLIANT
Q
Q
gs (nC)
gd (nC)
13
• Fully Characterized Capacitance and Avalanche Voltage
and Current
Configuration
Single
• Effective Coss Specified
• Lead (Pb)-free Available
D
DPAK
IPAK
(TO-252)
(TO-251)
APPLICATIONS
G
• Switch Mode Power Supply (SMPS)
• Uninterruptible Power Supply
• High Speed Power Switching
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFR430APbF
SiHFR430A-E3
IRFR430A
DPAK (TO-252)
IRFR430ATRPbFa
SiHFR430AT-E3a
IRFR430ATRa
DPAK (TO-252)
IRFR430ATRLPbFa
SiHFR430ATL-E3a
IRFR430ATRLa
SiHFR430ATLa
DPAK (TO-252)
IRFR430ATRRPbFa
SiHFR430ATR-E3a
IRFR430ATRRa
SiHFR430ATRa
IPAK (TO-251)
IRFU430APbF
SiHFU430A-E3
IRFU430A
Lead (Pb)-free
SnPb
SiHFR430A
SiHFR430ATa
SiHFU430A
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
500
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
30
TC = 25 °C
TC =100°C
5.0
Continuous Drain Current
VGS at 10 V
ID
3.2
A
Pulsed Drain Currenta
IDM
20
Linear Derating Factor
0.91
130
W/°C
mJ
A
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
Repetitive Avalanche Energya
EAS
IAR
5.0
EAR
11
mJ
W
Maximum Power Dissipation
TC = 25 °C
PD
110
Peak Diode Recovery dV/dtc
dV/dt
TJ, Tstg
3.0
V/ns
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
- 55 to + 150
300d
°C
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Starting TJ = 25 °C, L = 11 mH, RG = 25 Ω, IAS = 5.0 A (see fig. 12).
c. ISD ≤ 5.0 A, dI/dt ≤ 320 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
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