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IRF730AL PDF预览

IRF730AL

更新时间: 2024-11-20 05:39:27
品牌 Logo 应用领域
威世 - VISHAY 晶体晶体管开关脉冲
页数 文件大小 规格书
8页 166K
描述
Power MOSFET

IRF730AL 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active零件包装代码:TO-262AA
包装说明:IN-LINE, R-PSIP-T3针数:3
Reach Compliance Code:compliant风险等级:5.06
雪崩能效等级(Eas):290 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:400 V
最大漏极电流 (Abs) (ID):5.5 A最大漏极电流 (ID):5.5 A
最大漏源导通电阻:1 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-262AAJESD-30 代码:R-PSIP-T3
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):225极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):74 W最大脉冲漏极电流 (IDM):22 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IRF730AL 数据手册

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IRF730AS, SiHF730AS, IRF730AL, SiHF730AL  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Low Gate Charge Qg Results in Simple Drive  
Requirement  
PRODUCT SUMMARY  
VDS (V)  
400  
Available  
RDS(on) (Max.) (Ω)  
Qg (Max.) (nC)  
VGS = 10 V  
1.0  
RoHS*  
• Improved Gate, Avalanche and Dynamic dV/dt  
Ruggedness  
COMPLIANT  
22  
5.8  
Q
Q
gs (nC)  
gd (nC)  
• Fully Characterized Capacitance and Avalanche Voltage  
and Current  
9.3  
• Effective Coss Specified  
• Lead (Pb)-free Available  
Configuration  
Single  
D
D2PAK (TO-263)  
I2PAK (TO-262)  
APPLICATIONS  
• Switch Mode Power Supply (SMPS)  
• Uninterruptible Power Supply  
• High Sspeed Power Switching  
G
G
D
S
TYPICAL SMPS TOPOLOGIES  
S
N-Channel MOSFET  
• Single Transistor Flyback Xfmr. Reset  
• Single Transistor Forward Xfmr. Reset  
(Both US Line Input Only)  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
I2PAK (TO-262)  
IRF730ASPbF  
SiHF730AS-E3  
IRF730AS  
IRF730ASTRLPbFa  
SiHF730ASTL-E3a  
IRF730ASTRLa  
IRF730ASTRRPbFa  
SiHF730ASTR-E3a  
IRF730ALPbF  
Lead (Pb)-free  
SiHFL014T-E3  
-
-
-
-
SnPb  
SiHF730AS  
SiHF730ASTLa  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
VGS  
400  
V
30  
T
C = 25 °C  
5.5  
Continuous Drain Current  
VGS at 10 V  
ID  
A
TC =100°C  
3.5  
Pulsed Drain Currenta, e  
IDM  
22  
0.6  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb, e  
Avalanche Currenta  
EAS  
IAR  
290  
5.5  
Repetiitive Avalanche Energya  
EAR  
7.4  
mJ  
W
Maximum Power Dissipation  
TC = 25 °C  
PD  
74  
Peak Diode Recovery dV/dtc, e  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
dV/dt  
TJ, Tstg  
4.6  
V/ns  
- 55 to + 150  
300d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Starting TJ = 25 °C, L = 19 mH, RG = 25 Ω, IAS = 5.5 A (see fig. 12).  
c. ISD 5.5 A, dI/dt 90 A/µs, VDD VDS, TJ 150 °C.  
d. 1.6 mm from case.  
e. Uses IRF730A/SiHF730A data and test condition  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91046  
S-Pending-Rev. A, 30-May-08  
www.vishay.com  
1
WORK-IN-PROGRESS  

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