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IPB021N06N3G PDF预览

IPB021N06N3G

更新时间: 2024-11-20 05:39:23
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管
页数 文件大小 规格书
11页 479K
描述
OptiMOS™3 Power-Transistor Features Ideal for high frequency switching and sync. rec.

IPB021N06N3G 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:SMALL OUTLINE, R-PSSO-G2
针数:4Reach Compliance Code:compliant
ECCN代码:EAR99风险等级:5.8
雪崩能效等级(Eas):634 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (Abs) (ID):120 A最大漏极电流 (ID):120 A
最大漏源导通电阻:0.0021 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-263ABJESD-30 代码:R-PSSO-G2
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:2
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):250 W
最大脉冲漏极电流 (IDM):480 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:MATTE TIN端子形式:GULL WING
端子位置:SINGLE处于峰值回流温度下的最长时间:40
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

IPB021N06N3G 数据手册

 浏览型号IPB021N06N3G的Datasheet PDF文件第2页浏览型号IPB021N06N3G的Datasheet PDF文件第3页浏览型号IPB021N06N3G的Datasheet PDF文件第4页浏览型号IPB021N06N3G的Datasheet PDF文件第5页浏览型号IPB021N06N3G的Datasheet PDF文件第6页浏览型号IPB021N06N3G的Datasheet PDF文件第7页 
IPB021N06N3 G IPI024N06N3 G  
IPP024N06N3 G  
OptiMOS3 Power-Transistor  
Product Summary  
Features  
V DS  
60  
2.1  
120  
V
• Ideal for high frequency switching and sync. rec.  
• Optimized technology for DC/DC converters  
• Excellent gate charge x R DS(on) product (FOM)  
• Very low on-resistance RDS(on)  
R DS(on),max (SMD)  
I D  
mΩ  
A
• N-channel, normal level  
• 100% avalanche tested  
• Pb-free plating; RoHS compliant  
• Qualified according to JEDEC1) for target applications  
• Halogen-free according to IEC61249-2-21  
Type  
IPB021N06N3 G  
IPI024N06N3 G  
IPP024N06N3 G  
Package  
Marking  
PG-TO263-3  
021N06N  
PG-TO262-3  
024N06N  
PG-TO220-3  
024N06N  
Maximum ratings, at T j=25 °C, unless otherwise specified  
Value  
Parameter  
Symbol Conditions  
Unit  
T C=25 °C2)  
I D  
Continuous drain current  
120  
120  
A
T C=100 °C  
Pulsed drain current3)  
I D,pulse  
E AS  
T C=25 °C  
480  
Avalanche energy, single pulse4)  
Gate source voltage  
I D=100 A, R GS=25 Ω  
634  
mJ  
V
V GS  
±20  
P tot  
T C=25 °C  
Power dissipation  
250  
W
°C  
T j, T stg  
Operating and storage temperature  
-55 ... 175  
55/175/56  
IEC climatic category; DIN IEC 68-1  
1)J-STD20 and JESD22  
2) Current is limited by bondwire; with anR thJC=0.6 K/W the chip is able to carry 256A.  
3) See figure 3 for more detailed information  
4) See figure 13 for more detailed information  
Rev. 2.2  
page 1  
2009-12-11  

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