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IMX35

更新时间: 2024-09-16 05:39:15
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描述
i.MX35 Applications Processors for Industrial and Consumer Products

IMX35 数据手册

 浏览型号IMX35的Datasheet PDF文件第2页浏览型号IMX35的Datasheet PDF文件第3页浏览型号IMX35的Datasheet PDF文件第4页浏览型号IMX35的Datasheet PDF文件第5页浏览型号IMX35的Datasheet PDF文件第6页浏览型号IMX35的Datasheet PDF文件第7页 
Freescale Semiconductor  
Data Sheet: Advance Information  
Document Number: MCIMX35SR2CEC  
Rev. 6, 10/2009  
IMX35  
i.MX35 Applications  
Processors for Industrial  
and Consumer Products  
Silicon Revisions 2.0 and 2.1  
Package Information  
Plastic package  
Case 5284 17 x 17 mm, 0.8 mm Pitch  
Ordering Information  
See Table 1 on page 3 for ordering information.  
1
2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
1.1 Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Functional Description and Application Information . . . . . 4  
2.1 Application Processor Domain Overview. . . . . . . . . 4  
2.2 Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 5  
2.3 Advanced Power Management Overview . . . . . . . . 5  
2.4 ARM11 Microprocessor Core . . . . . . . . . . . . . . . . . 5  
2.5 Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Signal Descriptions: Special Function Related Pins . . . . 11  
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11  
4.1 i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 11  
4.2 Power Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
4.3 Supply Power-Up/Power-Down Requirements and  
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
4.4 Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
4.5 Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 17  
4.6 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . 18  
4.7 I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20  
4.8 I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23  
4.9 Module-Level AC Electrical Specifications. . . . . . . 29  
Package Information and Pinout . . . . . . . . . . . . . . . . . . 130  
5.1 MAPBGA Production Package 1568-01, 17 × 17 mm,  
0.8 Pitch. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131  
1 Introduction  
The i.MX353 and the i.MX357 multimedia  
applications processors represent the next  
generation of ARM11 products with the right  
performance and integration to address applications  
within the industrial and consumer markets for  
applications such as HMI and display controllers.  
Unless otherwise specified, the material in this data  
sheet is applicable to both the i.MX353 and  
i.MX357 devices and referred to singularly  
throughout this document as i.MX35 or  
MCIMX35. The i.MX353 devices do not include a  
graphics processing unit (GPU). For information on  
i.MX35 devices for automotive applications, please  
refer to document number, MCIMX35SR2AEC.  
3
4
5
The i.MX35 processor takes advantage of the  
ARM1136JF-S™ core running at 532 MHz that is  
boosted by a multi-level cache system and  
integrated features such as LCD controller,  
Ethernet, and graphics acceleration for creating rich  
user interfaces.  
5.2 MAPBGA Signal Assignments. . . . . . . . . . . . . . . 132  
Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . 145  
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145  
6
7
This document contains information on a product under development. Freescale reserves the  
right to change or discontinue this product without notice.  
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.  

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