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IDT71V35761S200BGI8 PDF预览

IDT71V35761S200BGI8

更新时间: 2024-11-09 14:42:47
品牌 Logo 应用领域
艾迪悌 - IDT 静态存储器内存集成电路
页数 文件大小 规格书
23页 512K
描述
Cache SRAM, 128KX36, 3.1ns, CMOS, PBGA119, 14 X 22 MM, POWER, PLASTIC, BGA-119

IDT71V35761S200BGI8 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:BGA包装说明:14 X 22 MM, POWER, PLASTIC, BGA-119
针数:119Reach Compliance Code:not_compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.35最长访问时间:3.1 ns
JESD-30 代码:R-PBGA-B119JESD-609代码:e0
长度:22 mm内存密度:4718592 bit
内存集成电路类型:CACHE SRAM内存宽度:36
湿度敏感等级:3功能数量:1
端子数量:119字数:131072 words
字数代码:128000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:128KX36封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
峰值回流温度(摄氏度):260认证状态:Not Qualified
座面最大高度:2.36 mm最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn63Pb37)
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:14 mmBase Number Matches:1

IDT71V35761S200BGI8 数据手册

 浏览型号IDT71V35761S200BGI8的Datasheet PDF文件第2页浏览型号IDT71V35761S200BGI8的Datasheet PDF文件第3页浏览型号IDT71V35761S200BGI8的Datasheet PDF文件第4页浏览型号IDT71V35761S200BGI8的Datasheet PDF文件第5页浏览型号IDT71V35761S200BGI8的Datasheet PDF文件第6页浏览型号IDT71V35761S200BGI8的Datasheet PDF文件第7页 
128K x 36, 256K x 18  
IDT71V35761  
IDT71V35781  
3.3VSynchronousSRAMs  
3.3VI/O,PipelinedOutputs  
BurstCounter,SingleCycleDeselect  
Features  
Description  
128K x 36, 256K x 18 memory configurations  
The IDT71V35761/781 are high-speed SRAMs organized as  
128Kx36/256Kx18.TheIDT71V35761/781SRAMscontainwrite,data,  
addressandcontrolregisters. InternallogicallowstheSRAMtogenerate  
aself-timedwritebaseduponadecisionwhichcanbeleftuntiltheendof  
thewritecycle.  
Supports high system speed:  
Commercial:  
– 200MHz 3.1ns clock access time  
CommercialandIndustrial:  
– 183MHz 3.3ns clock access time  
– 166MHz 3.5ns clock access time  
LBO input selects interleaved or linear burst mode  
Theburstmodefeatureoffersthehighestlevelofperformancetothe  
systemdesigner,astheIDT71V35761/81canprovidefourcyclesofdata  
forasingleaddress presentedtotheSRAM. Aninternalburstaddress  
Self-timedwritecyclewithglobalwritecontrol(GW),bytewrite counteracceptsthefirstcycleaddressfromtheprocessor,initiatingthe  
enable (BWE), and byte writes (BWx)  
3.3V core power supply  
Power down controlled by ZZ input  
3.3V I/O  
Packaged in a JEDEC Standard 100-pin plastic thin quad orderofthesethreeaddressesaredefinedbytheinternalburstcounter  
flatpack(TQFP),119ballgridarray(BGA)and165finepitchball andthe LBO inputpin.  
grid array  
accesssequence.Thefirstcycleofoutputdatawillbepipelinedforone  
cycle before it is available on the next rising clock edge. If burst mode  
operationisselected(ADV=LOW),thesubsequentthreecyclesofoutput  
datawillbeavailabletotheuseronthenextthreerisingclockedges. The  
TheIDT71V35761/781SRAMsutilizeIDT’slatesthigh-performance  
CMOSprocessandarepackagedinaJEDECstandard14mmx20mm  
100-pin thinplasticquadflatpack(TQFP)aswellasa119ballgridarray  
(BGA) and 165 fine pitch ball grid array.  
PinDescriptionSummary  
0
17  
A -A  
Address Inputs  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
Input  
I/O  
Synchronous  
Synchronous  
Synchronous  
Asynchronous  
Synchronous  
Synchronous  
Synchronous  
N/A  
Chip Enable  
CE  
0
1
CS , CS  
Chip Selects  
Output Enable  
OE  
Global Write Enable  
Byte Write Enable  
Individual Byte Write Selects  
Clock  
GW  
BWE  
(1)  
1,  
2,  
3,  
4
BW BW BW BW  
CLK  
ADV  
ADSC  
ADSP  
LBO  
Burst Address Advance  
Address Status (Cache Controller)  
Address Status (Processor)  
Linear / Interleaved Burst Order  
Sleep Mode  
Synchronous  
Synchronous  
Synchronous  
DC  
ZZ  
Asynchronous  
Synchronous  
N/A  
0
31  
P1  
P4  
I/O -I/O , I/O -I/O  
Data Input / Output  
Core Power, I/O Power  
Ground  
DD DDQ  
V , V  
Supply  
Supply  
SS  
V
N/A  
5301 tbl 01  
NOTE:  
1. BW3 and BW4 are not applicable for the IDT71V35781.  
OCTOBER 2000  
1
©2000IntegratedDeviceTechnology,Inc.  
DSC-5301/01  

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