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IBM25NPE405L-3FA133CZ PDF预览

IBM25NPE405L-3FA133CZ

更新时间: 2024-10-28 20:25:59
品牌 Logo 应用领域
国际商业机器公司 - IBM 时钟外围集成电路
页数 文件大小 规格书
52页 907K
描述
RISC Microprocessor, 32-Bit, 133MHz, CMOS, PBGA324, 23 X 23 MM, PLASTIC, EBGA-324

IBM25NPE405L-3FA133CZ 技术参数

生命周期:Transferred零件包装代码:BGA
包装说明:BGA, BGA324,22X22,40针数:324
Reach Compliance Code:unknownECCN代码:3A001.A.3
HTS代码:8542.31.00.01风险等级:5.47
Is Samacsys:N其他特性:ALSO REQUIRES 3.3V SUPPLY
地址总线宽度:13位大小:32
边界扫描:YES最大时钟频率:66.66 MHz
外部数据总线宽度:32格式:FIXED POINT
集成缓存:YESJESD-30 代码:S-PBGA-B324
长度:23 mm低功率模式:YES
端子数量:324最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA324,22X22,40
封装形状:SQUARE封装形式:GRID ARRAY
电源:2.5,3.3 V认证状态:Not Qualified
座面最大高度:2.65 mm速度:133 MHz
子类别:Microprocessors最大供电电压:2.7 V
最小供电电压:2.3 V标称供电电压:2.5 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:BALL
端子节距:1 mm端子位置:BOTTOM
宽度:23 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

IBM25NPE405L-3FA133CZ 数据手册

 浏览型号IBM25NPE405L-3FA133CZ的Datasheet PDF文件第46页浏览型号IBM25NPE405L-3FA133CZ的Datasheet PDF文件第47页浏览型号IBM25NPE405L-3FA133CZ的Datasheet PDF文件第48页浏览型号IBM25NPE405L-3FA133CZ的Datasheet PDF文件第49页浏览型号IBM25NPE405L-3FA133CZ的Datasheet PDF文件第50页浏览型号IBM25NPE405L-3FA133CZ的Datasheet PDF文件第51页 
Preliminary  
PowerNP NPe405L Embedded Processor Data Sheet  
(c) Copyright International Business Machines Corporation 1999, 2002  
All Rights Reserved  
Printed in the United States of America, October 2, 2002  
The following are trademarks of International Business Machines Corporation in  
the United States, or other countries, or both:  
Blue Logic  
CodePack  
CoreConnect  
IBM  
PowerPC  
IBM Logo  
PowerNP  
Other company, product, and service names may be trademarks or service marks  
of others.  
Preliminary Edition (October 2, 2002)  
This document contains information on a new product under development by IBM.  
IBM reserves the right to change or discontinue this product without notice.  
This document is a preliminary edition of the PowerNP NPe405L data sheet. Make  
sure you are using the correct edition for the level of the product.  
While the information contained herein is believed to be accurate, such  
information is preliminary, and should not be relied upon for accuracy or  
completeness, and no representations or warranties of accuracy or completeness  
are made.  
All information contained in this document is subject to change without notice. The  
products described in this document are NOT intended for use in applications  
such as implantation, life support, or other hazardous uses where malfunction  
could result in death, bodily injury, or catastrophic property damage. The  
information contained in this document does not affect or change IBM product  
specifications or warranties. Nothing in this document shall operate as an express  
or implied license or indemnity under the intellectual property rights of IBM or third  
parties. All information contained in this document was obtained in specific  
environments, and is presented as an illustration. The results obtained in other  
operating environments may vary.  
THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN  
"AS IS" BASIS. In no event will IBM be liable for damages arising directly or  
indirectly from any use of the information contained in this document.  
IBM Microelectronics Division  
1580 Route 52  
Hopewell Junction, NY 12533-6351  
The IBM home page is www. ibm.com.  
The IBM Microelectronics Division home is www.chips.ibm.com.  
SA14-2558-10  
52  

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