生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, BGA324,22X22,40 | 针数: | 324 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.47 |
Is Samacsys: | N | 其他特性: | ALSO REQUIRES 3.3V SUPPLY |
地址总线宽度: | 13 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 66.66 MHz |
外部数据总线宽度: | 32 | 格式: | FIXED POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B324 |
长度: | 23 mm | 低功率模式: | YES |
端子数量: | 324 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA324,22X22,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
电源: | 2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.65 mm | 速度: | 200 MHz |
子类别: | Microprocessors | 最大压摆率: | 600 mA |
最大供电电压: | 2.7 V | 最小供电电压: | 2.3 V |
标称供电电压: | 2.5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 23 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
IBM25NPE405L-3FA266C | AMCC | PowerNP |
获取价格 |
|
IBM25NPE405L-3FA266C | IBM | RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA324, 23 X 23 MM, PLASTIC, EBGA-324 |
获取价格 |
|
IBM25NPE405L-3FA266CZ | AMCC | PowerNP |
获取价格 |
|
IBM25NPE405L-3FA266CZ | IBM | RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA324, 23 X 23 MM, PLASTIC, EBGA-324 |
获取价格 |
|
IBM25PPC405CR-3BB200C | IBM | RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA316, 27 MM, PLASTIC, BGA-316 |
获取价格 |
|
IBM25PPC405CR-3BB200CZ | IBM | RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA316, 27 MM, PLASTIC, BGA-316 |
获取价格 |