5秒后页面跳转
HYB25D512800AC-6 PDF预览

HYB25D512800AC-6

更新时间: 2024-11-19 06:26:23
品牌 Logo 应用领域
英飞凌 - INFINEON 动态存储器双倍数据速率
页数 文件大小 规格书
77页 1225K
描述
DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 18 X 10 MM, FBGA-60

HYB25D512800AC-6 数据手册

 浏览型号HYB25D512800AC-6的Datasheet PDF文件第2页浏览型号HYB25D512800AC-6的Datasheet PDF文件第3页浏览型号HYB25D512800AC-6的Datasheet PDF文件第4页浏览型号HYB25D512800AC-6的Datasheet PDF文件第5页浏览型号HYB25D512800AC-6的Datasheet PDF文件第6页浏览型号HYB25D512800AC-6的Datasheet PDF文件第7页 
HYB25D512400/800/160AT(L)/AC(L)  
512-MBit Double Data Rata SDRAM  
Preliminary Version 12/01  
Features  
transitions  
CAS Latency and Frequency  
• Commands entered on each positive CK edge;  
data and data mask referenced to both edges of  
DQS  
Maximum Operating Frequency (MHz)  
CAS Latency  
DDR200  
-8  
DDR266A  
-7  
DDR333  
-6  
2
100  
125  
133  
143  
133  
166  
• Burst Lengths: 2, 4, or 8  
2.5  
• CAS Latency: (1.5), 2, 2.5, 3  
• Double data rate architecture: two data transfers  
per clock cycle  
• Auto Precharge option for each burst access  
• Auto Refresh and Self Refresh Modes  
• Bidirectional data strobe (DQS) is transmitted  
and received with data, to be used in capturing  
data at the receiver  
• 7.8µs Maximum Average Periodic Refresh  
Interval  
• 2.5V (SSTL_2 compatible) I/O  
• DQS is edge-aligned with data for reads and is  
center-aligned with data for writes  
• V  
= 2.5V ± 0.2V  
DDQ  
• V = 2.5V ± 0.2V  
DD  
• Differential clock inputs (CK and CK)  
• Four internal banks for concurrent operation  
• Data mask (DM) for write data  
• TSOP66 package  
60 balls BGA w/ 3 depop rows (chipsize pack-  
age) 18mm x 10mm.  
• DLL aligns DQ and DQS transitions with CK  
Description  
The 512Mb DDR SDRAM is a high-speed CMOS,  
dynamic random-access memory containing 536,870,912  
bits. It is internally configured as a quad-bank DRAM.  
with the Active command are used to select the bank and  
row to be accessed. The address bits registered coinci-  
dent with the Read or Write command are used to select  
the bank and the starting column location for the burst  
access.  
The 512Mb DDR SDRAM uses a double-data-rate archi-  
tecture to achieve high-speed operation. The double data  
rate architecture is essentially a 2n prefetch architecture  
with an interface designed to transfer two data words per  
clock cycle at the I/O pins. A single read or write access  
for the 512Mb DDR SDRAM effectively consists of a sin-  
gle 2n-bit wide, one clock cycle data transfer at the inter-  
nal DRAM core and two corresponding n-bit wide, one-  
half-clock-cycle data transfers at the I/O pins.  
The DDR SDRAM provides for programmable Read or  
Write burst lengths of 2, 4 or 8 locations. An Auto Pre-  
charge function may be enabled to provide a self-timed  
row precharge that is initiated at the end of the burst  
access.  
As with standard SDRAMs, the pipelined, multibank archi-  
tecture of DDR SDRAMs allows for concurrent operation,  
thereby providing high effective bandwidth by hiding row  
precharge and activation time.  
A bidirectional data strobe (DQS) is transmitted externally,  
along with data, for use in data capture at the receiver.  
DQS is a strobe transmitted by the DDR SDRAM during  
Reads and by the memory controller during Writes. DQS  
is edge-aligned with data for Reads and center-aligned  
with data for Writes.  
An auto refresh mode is provided along with a power-sav-  
ing power-down mode. All inputs are compatible with the  
JEDEC Standard for SSTL_2. All outputs are SSTL_2,  
Class II compatible.  
The 512Mb DDR SDRAM operates from a differential  
clock (CK and CK; the crossing of CK going HIGH and CK  
going LOW is referred to as the positive edge of CK).  
Commands (address and control signals) are registered at  
every positive edge of CK. Input data is registered on both  
edges of DQS, and output data is referenced to both  
edges of DQS, as well as to both edges of CK.  
Note: The functionality described and the timing specifi-  
cations included in this data sheet are for the DLL Enabled  
mode of operation.  
Read and write accesses to the DDR SDRAM are burst  
oriented; accesses start at a selected location and con-  
tinue for a programmed number of locations in a pro-  
grammed sequence. Accesses begin with the registration  
of an Active command, which is then followed by a Read  
or Write command. The address bits registered coincident  
12/01  
Page 1 of 77  

与HYB25D512800AC-6相关器件

型号 品牌 获取价格 描述 数据表
HYB25D512800AE-8 INFINEON

获取价格

DDR DRAM, 64MX8, 0.8ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66
HYB25D512800AEL-6 INFINEON

获取价格

DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66
HYB25D512800AFL-6 INFINEON

获取价格

DDR DRAM, 64MX8, 0.7ns, CMOS, PBGA60, 18 X 10 MM, FBGA-60
HYB25D512800AT INFINEON

获取价格

512Mbit Double Data Rate SDRAM
HYB25D512800AT-6 INFINEON

获取价格

512Mbit Double Data Rate SDRAM
HYB25D512800AT-7 INFINEON

获取价格

512Mbit Double Data Rate SDRAM
HYB25D512800AT-7F INFINEON

获取价格

512Mbit Double Data Rate SDRAM
HYB25D512800AT-8 INFINEON

获取价格

DDR DRAM, 64MX8, 0.8ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66
HYB25D512800ATL-6 INFINEON

获取价格

DDR DRAM, 64MX8, 0.7ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66
HYB25D512800ATL-7 INFINEON

获取价格

DDR DRAM, 64MX8, 0.75ns, CMOS, PDSO66, 0.400 INCH, PLASTIC, TSOP2-66