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HY5W26CF-H PDF预览

HY5W26CF-H

更新时间: 2024-11-06 23:57:15
品牌 Logo 应用领域
其他 - ETC 动态存储器
页数 文件大小 规格书
24页 407K
描述
SDRAM|4X2MX16|CMOS|BGA|54PIN|PLASTIC

HY5W26CF-H 数据手册

 浏览型号HY5W26CF-H的Datasheet PDF文件第2页浏览型号HY5W26CF-H的Datasheet PDF文件第3页浏览型号HY5W26CF-H的Datasheet PDF文件第4页浏览型号HY5W26CF-H的Datasheet PDF文件第5页浏览型号HY5W26CF-H的Datasheet PDF文件第6页浏览型号HY5W26CF-H的Datasheet PDF文件第7页 
HY5W2A6C(L/S)F / HY57W2A1620HC(L/S)T  
HY5W26CF / HY57W281620HCT  
4Banks x 2M x 16bits Synchronous DRAM  
DESCRIPTION  
The Hynix Low Power SDRAM is suited for non-PC application which use the batteries such as PDAs,  
2.5G and 3G cellular phones with internet access and multimedia capabilities, mini-notebook, handheld  
PCs.  
The Hynix HY5W2A6CF is a 134,217,728bit CMOS Synchronous Dynamic Random Access Memory. It  
is organized as 4banks of 2,097,152x16.  
The Low Power SDRAM provides for programmable options including CAS latency of 1, 2, or 3, READ  
or WRITE burst length of 1, 2, 4, 8, or full page, and the burst count sequence(sequential or interleave).  
And the Low Power SDRAM also provides for special programmable options including Partial Array Self  
Refresh of a quarter bank, a half bank, 1bank, 2banks, or all banks, Temperature Compensated Self  
Refresh of 15, 45, 70, or 85 degrees C. A burst of Read or Write cycles in progress can be terminated  
by a burst terminate command or can be interrupted and replaced by a new burst Read or Write com-  
mand on any cycle(This pipelined design is not restricted by a 2N rule).  
Deep Power Down Mode is a additional operating mode for Low Power SDRAM. This mode can achieve  
maximum power reduction by removing power to the memory array within each SDRAM. By using this  
feature, the system can cut off alomost all DRAM power without adding the cost of a power switch and  
giving up mother-board power-line layout flexibility.  
FEATURES  
Standard SDRAM Protocol  
Internal 4bank operation  
Voltage : VDD = 2.5V, VDDQ = 1.8V & 2.5V  
LVTTL compatible I/O Interface  
Low Voltage interface to reduce I/O power  
Low Power Features ( HY5W26CF / HY57W281620HCT series can’t support these features)  
- PASR(Partial Array Self Refresh)  
- TCSR(Temperature Compensated Self Refresh)  
- Deep Power Down Mode  
CAS latency of 1, 2, or 3  
Packages : 54ball, 0.8mm pitch FBGA / 54pin, TSOP  
-25 ~ 85C Operation  
128M SDRAM ODERING INFORMATION  
Clock  
CAS  
Part Number  
Organization  
Interface  
Package  
Frequency Latency  
HY5W2A6C(L/S)F-H  
HY5W26CF-H  
133MHz  
100MHz  
100MHz  
66Mhz  
3
2
3
2
4banks x 2Mb x 16  
LVTTL  
HY57W2A1620HC(L/S)T-H  
HY57W281620HCT-H  
HY5W2A6C(L/S)F-P  
HY5W26CF-P  
HY57W2A1620HC(L/S)T-P  
HY57W281620HCT-P  
4banks x 2Mb x 16  
4banks x 2Mb x 16  
4banks x 2Mb x 16  
LVTTL  
LVTTL  
LVTTL  
54ball FBGA  
(HY5xxxxxxF)  
54pin TSOP-II  
(HY5xxxxxxT)  
HY5W2A6C(L/S)F-S  
HY5W26CF-S  
HY57W2A1620HC(L/S)T-S  
HY57W281620HCT-S  
HHY5W2A6C(L/S)F-B  
HY5W26CF-B  
HY57W2A1620HC(L/S)T-B  
HY57W281620HCT-B  
* HY5xxxxxx-B Series can support 40Mhz CL1 and 33Mhz CL1.  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev. 1.3 / Dec. 01  

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