HFA70NC60CSM

更新时间： 2024-11-11 10:47:51

品牌	Logo	应用领域
英飞凌 - INFINEON		整流二极管软恢复二极管
页数	文件大小	规格书
5页	178K
描述
Ultrafast, Soft Recovery Diode

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HFA70NC60CSM 数据手册

PD -2.459 rev. B 01/99

HFA70NC60CSM

HEXFRED^TM

Ultrafast, Soft Recovery Diode

V_R= 600V

V_F(typ.) = 1.2V

I_F(AV)= 70A

Features

• Reduced RFI and EMI

• Reduced Snubbing

• Extensive Characterization of

Recovery Parameters

Q_rr(typ.) = 210nC

I_RRM(typ.) = 6A

t_rr(typ.) = 30ns

di_(rec)M/dt (typ.) = 180A/µs

Description

HEXFRED^TMdiodes are optimized to reduce losses and EMI/RFI in high frequency

power conditioning systems. An extensive characterization of the recovery

behavior for different values of current, temperature and di/dt simplifies the

calculations of losses in the operating conditions. The softness of the recovery

eliminates the need for a snubber in most applications. These devices are ideally

suited for power converters, motors drives and other applications where

switching losses are significant portion of the total losses.

SMD-61-8

Absolute Maximum Ratings (per Leg)

Parameter

Max.

600

Units

V_R

Cathode-to-Anode Voltage

Continuous Forward Current

Single Pulse Forward Current

Non-Repetitive Avalanche Energy

Maximum Power Dissipation

Operating Junction and

I_F@ T_C= 25°C

I_F@ T_C= 100°C

I_FSM

200

220

150

E_AS

µJ

P_D@ T_C= 25°C

P_D@ T_C= 100°C

T_J

-55 to +150

°C

T_STG

Storage Temperature Range

Soldering Temperature, for 10 sec.

300 (0.063 in. (1.6mm) from case)

Thermal - Mechanical Characteristics

Parameter

Min.

––––

Typ.

––––

Max.

0.85

Units

R_thJC

Junction-to-Case, Single Leg Conducting

Junction-to-Case, Both Legs Conducting

Weight

°C/W

K/W

––––

0.42

4.3 (0.15)

––––

g (oz)

Note: Limited by junction temperature

L = 100µH, duty cycle limited by max T_J

125°C

12 3 4 5

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