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GS832018AGT-400 PDF预览

GS832018AGT-400

更新时间: 2024-11-20 00:44:03
品牌 Logo 应用领域
GSI 静态存储器
页数 文件大小 规格书
24页 253K
描述
2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs

GS832018AGT-400 数据手册

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GS832018/32/36AGT-400/375/333/250/200/150  
400 MHz150 MHz  
100-Pin TQFP  
Commercial Temp  
Industrial Temp  
2M x 18, 1M x 32, 1M x 36  
36Mb Sync Burst SRAMs  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
internally and are controlled by ADV. The burst address  
counter may be configured to count in either linear or  
interleave order with the Linear Burst Order (LBO) input. The  
Burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
Features  
• FT pin for user-configurable flow through or pipeline  
operation  
• Single Cycle Deselect (SCD) operation  
• 2.5 V or 3.3 V +10%/10% core power supply  
• 2.5 V or 3.3 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to Interleaved Pipeline mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by  
the user via the FT mode pin (Pin 14). Holding the FT mode  
pin low places the RAM in Flow Through mode, causing  
output data to bypass the Data Output Register. Holding FT  
high places the RAM in Pipeline mode, activating the rising-  
edge-triggered Data Output Register.  
• Automatic power-down for portable applications  
• RoHS-compliant 100-lead TQFP package  
Functional Description  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Applications  
The GS832018/32/36AGT is a 37,748,736-bit high  
performance synchronous SRAM with a 2-bit burst address  
counter. Although of a type originally developed for Level 2  
Cache applications supporting high performance CPUs, the  
device now finds application in synchronous SRAM  
applications, ranging from DSP main store to networking chip  
set support.  
Sleep Mode  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Controls  
Addresses, data I/Os, chip enables (E1, E2, E3), address burst  
control inputs (ADSP, ADSC, ADV), and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
Core and Interface Voltages  
The GS832018/32/36AGT operates on a 3.3 V or 2.5 V power  
supply. All input are 3.3 V and 2.5 V compatible. Separate  
output power (V  
) pins are used to decouple output noise  
DDQ  
from the internal circuits and are 3.3 V and 2.5 V compatible.  
Parameter Synopsis  
-400  
-375  
-333  
-250  
-200  
-150  
Unit  
t
2.5  
2.5  
2.5  
2.66  
2.5  
3.3  
2.5  
4.0  
3.0  
5.0  
3.8  
6.7  
ns  
ns  
KQ  
Pipeline  
3-1-1-1  
tCycle  
Curr (x18)  
Curr (x32/x36)  
395  
475  
390  
455  
355  
415  
280  
335  
240  
280  
205  
230  
mA  
mA  
t
4.0  
4.0  
4.2  
4.2  
4.5  
4.5  
5.5  
5.5  
6.5  
6.5  
7.5  
7.5  
ns  
ns  
KQ  
Flow  
Through  
2-1-1-1  
tCycle  
Curr (x18)  
Curr (x32/x36)  
290  
335  
275  
320  
260  
305  
235  
270  
200  
240  
190  
220  
mA  
mA  
Rev: 1.03 8/2013  
1/23  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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