FLAT-PAC™ 3
Low Profile Inductors
Description
RoHS
2002/95/EC
• 155°C maximum total temperature operation
• Low profile high current inductors
• Inductance range 0.1uh to 15uh
• Design utilizes high temperature powder iron material with a
non-organic binder to eliminate thermal aging
• Current rating up to 34.7Adc (Higher peak currents may be
attained with a greater rolloff, see rolloff curve)
• Frequency range up to 2MHz
Applications
• Computers and portable power devices
• Energy storage applications
• DC-DC converters
• Input - Output filer application
Packaging
Environmental Data
• Units supplied in tape and reel packaging.
Reel quantity = 1,700 parts per reel.
• Storage temperature range: -40°C to +155°C
• Operating ambient temperature range: -40°C to +155°C
(range is application specific).
• Solder reflow temperature: +260°C max. for 10 seconds max.
Part
Rated
Inductance
µH
OCL (1)
Irms (2)
Isat (3)
Isat (4)
Amperes
Approx. 15%
34.7
DCR
mOhms @ 20°C
(Max.)
1.21
K-factor (5)
Number
µH 15%
Amperes
Amperes
Approx. 10%
FP3-R10-R
FP3-R20-R
FP3-R47-R
FP3-R68-R
FP3-1R0-R
FP3-1R5-R
FP3-2R0-R
FP3-3R3-R
FP3-4R7-R
FP3-8R2-R
FP3-100-R
FP3-150-R
0.10
0.20
0.47
0.68
1.00
1.50
2.00
3.30
4.70
8.20
10.0
15.0
0.10
0.22
0.44
0.72
1.10
1.50
2.00
3.20
4.70
8.5
19.0
15.3
10.9
9.72
6.26
5.78
5.40
3.63
3.23
2.91
2.30
2.22
27
16
803
482
344
268
219
185
161
127
105
78
20.8
14.9
11.6
9.5
8.0
6.9
5.5
4.2
1.88
3.67
4.63
11.2
13.1
15.0
30.0
40.0
11.6
9.0
7.4
6.2
5.4
4.3
3.5
2.6
2.3
2.0
3.4
3.0
2.5
74.0
101
127
10.9
14.9
69
59
1) OCL (Open Circuit Inductance) Test parameters: 100kHz, 0.1Vrms, 0.0Adc
2) DC current for an approximate ∆T of 40°C without core loss. Derating is
necessary for AC currents. PCB layout, trace thickness and width, air-flow, and
proximity of other heat generating components will affect the temperature rise.
It is recommended that the temperature of the part not exceed 155°C under
worst case operating conditions verified in the end application.
3) Isat Amperes Peak for approximately 10% rolloff @ 20°C
4) Isat Amperes Peak for approximately 15% rolloff @ 20°C
5) K-factor: Used to determine B p-p for core loss (see graph). B p-p =K*L*∆I
B p-p:(Gauss), K: (K factor from table), L: (Inductance in uH), ∆I (Peak to peak
ripple current in Amps).
TOP VIEW
Mechanical Diagrams
RECOMMENDED PCB PAD LAYOUT
SCHEMATIC
SIDE VIEW
2.8 0.25
(2x)
1
FRONT VIEW
1.0 min.
(2x)
1
FP3
XXX
3.00 Max
7.25
Max
7.50
yww
2.50 (2x)
2
2.8 0.25
(2x)
2
4.50 (2x)
6.70
Max
1.5 Dia
+0.1/-0.0
1.5 Dia
min.
0.30
Packaging Information
4.0
2.0
1.75
A
+/-0.05
0.3 Rad
max.
1
7.5
16.0
+/-0.3
Bo
2
Ao= 6.6mm
Bo= 7.1mm
Ko= 3.2mm
A
Ao
xxx = Inductance value
yww = Date code
0.5 Rad
typ.
Ko
Dimensions in Millimeters
12.0
SECTION A-A
Direction of Feed