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FMMT591 PDF预览

FMMT591

更新时间: 2024-11-09 10:34:51
品牌 Logo 应用领域
美微科 - MCC 晶体晶体管
页数 文件大小 规格书
3页 235K
描述
PNP Plastic-Encapsulate Transistor

FMMT591 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.1最大集电极电流 (IC):1 A
集电极-发射极最大电压:60 V配置:SINGLE
最小直流电流增益 (hFE):100JESD-30 代码:R-PDSO-G3
JESD-609代码:e0元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240极性/信道类型:PNP
认证状态:Not Qualified表面贴装:YES
端子面层:TIN LEAD端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:30
晶体管元件材料:SILICON标称过渡频率 (fT):150 MHz
Base Number Matches:1

FMMT591 数据手册

 浏览型号FMMT591的Datasheet PDF文件第2页浏览型号FMMT591的Datasheet PDF文件第3页 
M C C  
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TM  
FMMT591  
Micro Commercial Components  
Features  
·
Lead Free Finish/RoHS Compliant ("P" Suffix designates  
Pin Configuration  
RoHS Compliant. See ordering information)  
Power dissipation: PCM=0.5W(Tamb=25?)  
Collector current: Ic=1A  
Top View  
PNP  
·
C
Plastic-Encapsulate  
Transistor  
Epoxy meets UL 94 V-0 flammability rating  
Moisure Sensitivity Level 1  
591  
·
B
E
Maximum Ratings*  
Symbol  
Rating  
Rating  
60  
80  
5.0  
1.0  
Unit  
V
V
V
A
VCEO  
VCBO  
VEBO  
IC  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
SOT-23  
A
D
Collector Current,  
Ptot  
Power Dissipation at Tamb=25R  
Operating Junction Temperature  
Storage Temperature  
500  
mW  
TJ  
-55 to +150  
-55 to +150  
R
R
B
C
TSTG  
F
E
O
Electrical Characteristics @ 25 C Unless Otherwise Specified  
Symbol  
Parameter  
Min  
Max  
Units  
OFF CHARACTERISTICS  
V(BR)CEO  
V(BR)CBO  
V(BR)EBO  
ICBO  
Collector-Emitter Breakdown Voltage*  
(IC=10mAdc, IB=0)  
Collector-Base Breakdown Voltage  
(IC=100µAdc, IE=0)  
Emitter-Base Breakdown Voltage  
(IE=100µAdc, IC=0)  
Collector Cutoff Current  
(VCB=60Vdc, IE=0Vdc)  
H
G
J
60  
80  
5.0  
---  
---  
---  
Vdc  
Vdc  
K
DIMENSIONS  
---  
Vdc  
INCHES  
MIN  
MM  
DIM  
A
B
C
D
E
MAX  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
.100  
1.12  
.180  
.51  
NOTE  
0.1  
0.1  
uAdc  
uAdc  
Vdc  
.110  
.083  
.047  
.035  
.070  
.018  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
IEBO  
Emitter Cutoff Current  
(VEB=4.0Vdc, IC=0)  
---  
VCE(sat)  
Collector-Emitter Saturation Voltage*  
(IC=500mAdc, IB=50mAdc)  
(IC=1Adc, IB=100mAdc)  
Base-Emitter Saturation Voltage*  
(IC=1Adc, IB=100mAdc)  
Base-Emitter Voltage*  
(VCE=5Vdc, IC=1Adc)  
DC Current Gain  
(VCE=5Vdc, IC=1mAdc)  
(VCE=5Vdc, IC=500mAdc)*  
(VCE=5Vdc, IC=1Adc)*  
---  
---  
0.3  
0.6  
F
G
H
J
.0005  
.035  
.003  
.015  
VBE(sat)  
VBE  
.085  
.37  
---  
---  
1.2  
1
Vdc  
Vdc  
K
Suggested Solder  
Pad Layout  
hFE  
100  
100  
80  
---  
300  
---  
---  
.031  
.800  
(VCE=5Vdc, IC=2Adc)*  
Transition Frequency  
(IC=50mAdc, VCE=10Vdc, f=100MHz)  
Output Capacitance  
15  
---  
.035  
.900  
fT  
150  
---  
---  
MHz  
pF  
Cob  
.079  
2.000  
inches  
mm  
(VCB=10Vdc, f=1.0MHz)  
10  
* Measured under pulsed conditions. Pulse width=300us. Duty cycle!2%  
.037  
.950  
.037  
.950  
www.mccsemi.com  
Revision: A  
2011/01/01  
1 of 3  

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