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FDT86106LZ PDF预览

FDT86106LZ

更新时间: 2024-11-02 11:12:19
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
7页 285K
描述
N 沟道,PowerTrench® MOSFET,100V,3.2A,108mΩ

FDT86106LZ 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G4Reach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
Factory Lead Time:26 weeks风险等级:1.53
Samacsys Confidence:4Samacsys Status:Released
Samacsys PartID:5362Samacsys Pin Count:4
Samacsys Part Category:Integrated CircuitSamacsys Package Category:SOT223 (3-Pin)
Samacsys Footprint Name:SOT-223 4L-6Samacsys Released Date:2015-04-22 06:39:31
Is Samacsys:N其他特性:LOGIC LEVEL COMPATIBLE, ULTRA-LOW RESISTANCE
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:100 V最大漏极电流 (Abs) (ID):3.2 A
最大漏极电流 (ID):3.2 A最大漏源导通电阻:0.108 Ω
FET 技术:METAL-OXIDE SEMICONDUCTOR最大反馈电容 (Crss):5 pF
JESD-30 代码:R-PDSO-G4JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:4工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):2.2 W认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDT86106LZ 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – N-Channel,  
POWERTRENCH)  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
100 V  
108 mW @ 10 V  
153 mW @ 4.5 V  
3.2 A  
100 V, 3.2 A, 108 mW  
FDT86106LZ  
D
General Description  
This NChannel logic Level MOSFETs are produced using  
onsemi’s advanced POWERTRENCH process that has been special  
tailored to minimize the onstate resistance and yet maintain superior  
switching performance. GS zener has been added to enhance ESD  
voltage level.  
S
D
G
SOT223  
CASE 318H  
Features  
Max r  
Max r  
= 108 mW at V = 10 V, I = 3.2 A  
GS D  
DS(on)  
DS(on)  
MARKING DIAGRAM  
= 153 mW at V = 4.5 V, I = 2.7 A  
GS  
D
High Performance Trench Technology for Extremely Low r  
High Power and Current Handling Capability in a Widely Used  
Surface Mount Package  
HBM ESD Protection Level > 3 kV Typical (Note 4)  
100% UIL Tested  
DS(on)  
AYW  
106LZG  
G
1
A
Y
= Specific Device Code  
= Date Code  
This Device is PbFree, Halide Free and is RoHS Compliant  
W
= Work Week  
Applications  
DC DC Conversion  
106LZ = Specific Device Code  
G
= PbFree Package  
(Note: Microdot may be in either location)  
MOSFET MAXIMUM RATINGS (TC = 25C unless otherwise noted)  
Symbol  
Parameter  
DrainSource Voltage  
Ratings Unit  
V
DS  
100  
20  
3.2  
V
V
A
PINOUT  
V
GS  
GateSource Voltage  
D
I
D
Drain Current  
Continuous  
A
T = 25C  
(Note 1a.)  
Pulsed  
12  
12  
E
Single Pulse Avalanche Energy  
(Note 3)  
mJ  
W
AS  
P
Power  
Dissipation  
T = 25C  
(Note 1a.)  
(Note 1b.)  
2.2  
1.0  
D
A
G
D
S
T = 25C  
A
T , T  
Operating and Storage Junction  
Temperature Range  
55 to  
+150  
C  
J
STG  
ORDERING INFORMATION  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
Device  
FDT86106LZ  
Package  
Shipping  
106LZ  
4000 / Tape &  
Reel  
THERMAL CHARACTERISTICS  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
Symbol  
RqJC  
Parameter  
Ratings  
12  
Unit  
C/W  
C/W  
Thermal Resistance, Junction to Case  
RqJA  
Thermal Resistance, Junction to Ambient  
(Note 1a.)  
55  
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
July, 2022 Rev. 3  
FDT86106LZ/D  

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