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FDPF44N25T PDF预览

FDPF44N25T

更新时间: 2024-11-19 22:15:19
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
7页 884K
描述
250V N-Channel MOSFET

FDPF44N25T 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:TO-220F
包装说明:LEAD FREE, TO-220F, 3 PIN针数:3
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8541.29.00.95风险等级:3.98
雪崩能效等级(Eas):2055 mJ外壳连接:ISOLATED
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:250 V
最大漏极电流 (Abs) (ID):18 A最大漏极电流 (ID):44 A
最大漏源导通电阻:0.069 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
JESD-609代码:e3元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:FLANGE MOUNT
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):56 W最大脉冲漏极电流 (IDM):176 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:NO端子面层:Matte Tin (Sn)
端子形式:THROUGH-HOLE端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICON

FDPF44N25T 数据手册

 浏览型号FDPF44N25T的Datasheet PDF文件第2页浏览型号FDPF44N25T的Datasheet PDF文件第3页浏览型号FDPF44N25T的Datasheet PDF文件第4页浏览型号FDPF44N25T的Datasheet PDF文件第5页浏览型号FDPF44N25T的Datasheet PDF文件第6页浏览型号FDPF44N25T的Datasheet PDF文件第7页 
TM  
UniFET  
FDPF44N25  
250V N-Channel MOSFET  
Features  
Description  
18A, 250V, RDS(on) = 0.069@VGS = 10 V  
Low gate charge ( typical 47 nC)  
Low Crss ( typical 60 pF)  
Fast switching  
These N-Channel enhancement mode power field effect transis-  
tors are produced using Fairchild’s proprietary, planar stripe,  
DMOS technology.  
This advanced technology has been especially tailored to mini-  
mize on-state resistance, provide superior switching perfor-  
mance, and withstand high energy pulse in the avalanche and  
commutation mode. These devices are well suited for high effi-  
cient switched mode power supplies and active power factor  
correction.  
100% avalanche tested  
Improved dv/dt capability  
D
G
TO-220F  
FDPF Series  
G D  
S
S
Absolute Maximum Ratings  
Symbol  
Parameter  
FDPF44N25  
Unit  
VDSS  
Drain-Source Voltage  
Drain Current  
250  
V
ID  
- Continuous (TC = 25°C)  
- Continuous (TC = 100°C)  
18  
10.8  
A
A
(Note 1)  
(Note 2)  
IDM  
Drain Current  
- Pulsed  
72  
±30  
2055  
18  
A
V
VGSS  
EAS  
IAR  
Gate-Source voltage  
Single Pulsed Avalanche Energy  
Avalanche Current  
mJ  
A
(Note 1)  
(Note 1)  
(Note 3)  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
5.6  
mJ  
V/ns  
4.5  
Power Dissipation  
(TC = 25°C)  
56  
W
- Derate above 25°C  
0.45  
W/°C  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
°C  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
°C  
Thermal Characteristics  
Symbol  
Parameter  
Min.  
Max.  
2.23  
Unit  
°C/W  
°C/W  
RθJC  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
--  
--  
62.5  
©2005 Fairchild Semiconductor Corporation  
FDPF44N25 Rev A  
1
www.fairchildsemi.com  

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