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FDG6321C PDF预览

FDG6321C

更新时间: 2024-09-17 11:14:43
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管
页数 文件大小 规格书
9页 229K
描述
双 N 和 P 沟道数字 FET 25V

FDG6321C 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
风险等级:0.9Samacsys Confidence:3
Samacsys Status:ReleasedSamacsys PartID:1579167
Samacsys Pin Count:6Samacsys Part Category:Transistor
Samacsys Package Category:SOT23 (6-Pin)Samacsys Footprint Name:FDG6321C
Samacsys Released Date:2019-06-12 05:47:43Is Samacsys:N
其他特性:LOGIC LEVEL COMPATIBLE配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:25 V最大漏极电流 (ID):0.5 A
最大漏源导通电阻:0.45 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:N-CHANNEL AND P-CHANNEL
最大功率耗散 (Abs):0.3 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin (Sn)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDG6321C 数据手册

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DATA SHEET  
www.onsemi.com  
Digital FET, Dual N & P  
Channel  
S2  
G2  
D1  
D2  
G1  
FDG6321C  
S1  
SC88/SC706/SOT363  
CASE 419B02  
General Description  
These dual N & PChannel logic level enhancement mode field  
effect transistors are produced using onsemi’s proprietary, high cell  
density, DMOS technology. This very high density process is  
especially tailored to minimize onstate resistance. This device has  
been designed especially on low voltage replacement for bipolar  
digital transistors and small signal MOSFETS. Since bias resistors are  
not required, this dual digital FET can replace several different digital  
transistors, with different bias resistor values.  
MARKING DIAGRAM  
21M  
21  
M
= Specific Device Code  
= Assembly Operation Month  
Features  
NCh 0.50 A, 25 V  
R  
R  
= 0.45 W @ V = 4.5 V  
GS  
DS(ON)  
= 0.60 W @ V = 2.7 V  
DS(ON)  
GS  
PIN CONNECTIONS  
PCh 0.41 A, 25 V  
R  
R  
= 1.1 W @ V = 4.5 V  
GS  
DS(ON)  
= 1.5 W @ V = 2.7 V  
DS(ON)  
GS  
1
6
Very Small Package Outline SC706  
Very Low Level Gate Drive Requirements Allowing Direct  
2
3
5
4
Operation in 3 V Circuits (V  
< 1.5 V)  
GS(th)  
GateSource Zener for ESD Ruggedness (>6 kV Human Body  
Model)  
These Devices are PbFree and are RoHS Compliant  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Symbol  
Parameter  
DrainSource Voltage  
GateSource Voltage  
Drain Current Continuous  
Pulsed  
NChannel PChannel Units  
V
DSS  
25  
8
25  
8  
V
V
A
ORDERING INFORMATION  
V
GSS  
Device  
Package  
Shipping  
I
D
0.5  
1.5  
0.41  
1.2  
FDG6321C  
SC88/SC706/  
SOT363  
3000 /  
Tape & Reel  
(PbFree)  
P
Maximum Power Dissipation  
(Note 1)  
0.3  
W
°C  
kV  
D
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
T , T  
Operating and Storage  
Temperature Range  
55 to 150  
J
STG  
ESD  
Electrostatic Discharge  
Rating MILSTD883D  
Human Body Model (100 pF /  
1500 W)  
6
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
© Semiconductor Components Industries, LLC, 1998  
1
Publication Order Number:  
May, 2023 Rev. 6  
FDG6321C/D  

FDG6321C 替代型号

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