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FDFMA2P029Z PDF预览

FDFMA2P029Z

更新时间: 2024-11-17 11:13:31
品牌 Logo 应用领域
安森美 - ONSEMI 开关光电二极管晶体管肖特基二极管
页数 文件大小 规格书
8页 254K
描述
集成式 P 沟道,Power Trench® MOSFET 和肖特基二极管,-20V,3.1A,95mΩ

FDFMA2P029Z 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, S-PDSO-N6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.29.00.95
风险等级:0.95外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):3.1 A最大漏极电流 (ID):3.1 A
最大漏源导通电阻:0.95 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
最大反馈电容 (Crss):150 pFJEDEC-95代码:MO-229VCCC
JESD-30 代码:S-PDSO-N6JESD-609代码:e4
湿度敏感等级:1元件数量:1
端子数量:6工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:SQUARE封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):NOT SPECIFIED极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):1.4 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)端子形式:NO LEAD
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

FDFMA2P029Z 数据手册

 浏览型号FDFMA2P029Z的Datasheet PDF文件第2页浏览型号FDFMA2P029Z的Datasheet PDF文件第3页浏览型号FDFMA2P029Z的Datasheet PDF文件第4页浏览型号FDFMA2P029Z的Datasheet PDF文件第5页浏览型号FDFMA2P029Z的Datasheet PDF文件第6页浏览型号FDFMA2P029Z的Datasheet PDF文件第7页 
DATA SHEET  
www.onsemi.com  
MOSFET  
MOSFET – P-Channel,  
POWERTRENCH) Integrated  
with Schottky Diode  
V
MAX  
r
MAX  
I MAX  
D
DS  
DS(on)  
20 V  
95 mW @ 4.5 V  
141 mW @ 2.5 V  
3.1 A  
-20 V, -3.1 A, 95 mW  
SCHOTTKY DIODE  
V
RRM  
MAX  
V MAX  
F
I MAX  
O
FDFMA2P029Z,  
FDFMA2P029Z-F106  
20 V  
0.37 V @ 500 mA  
2 A  
Pin 1  
C
A
General Description  
NC  
D
This device is designed specifically as a single package solution for  
the battery charge switch in cellular handset and other ultraportable  
applications. It features a MOSFET with very low onstate resistance  
and an independently connected low forward voltage schottky diode  
allows for minimum conduction losses.  
The MicroFETt 2X2 package offers exceptional thermal  
performance for its physical size and is well suited to linear mode  
applications.  
D
C
G
S
WDFN6 2x2, 0.65P  
MicroFET  
CASE 511DA  
Features  
MOSFET  
MARKING DIAGRAM  
Max r  
Max r  
= 95 mW at V = –4.5 V, I = 3.1 A  
GS D  
DS(on)  
&Z&2&K  
P29  
= 141 mW at V = –2.5 V, I = 2.5 A  
DS(on)  
GS  
D
HBM ESD Protection Level > 2.5 kV (Note 1)  
Schottky  
V < 0.37 V @ 500 mA  
F
&Z = Assembly Plant Code  
&2 = 2Digit Date Code  
&K = 2Digits Lot Run Traceability Code  
P29 = Device Code  
Low Profile 0.8 mm Maximum In the New Package MicroFET  
2x2 mm  
These Devices are PbFree and are RoHS Compliant  
NOTE:  
PIN CONNECTIONS  
1. The diode connected between the gate and source serves only  
protection against ESD. No gate overvoltage rating is implied.  
A
NC  
D
1
2
3
6
5
4
C
G
S
ORDERING INFORMATION  
See detailed ordering and shipping information on page 6 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2008  
1
Publication Order Number:  
February, 2022 Rev. 3  
FDFMA2P029Z/D  
 

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