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FDD2512 PDF预览

FDD2512

更新时间: 2024-11-17 22:31:47
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体晶体管功率场效应晶体管开关脉冲
页数 文件大小 规格书
5页 88K
描述
150V N-Channel PowerTrench MOSFET

FDD2512 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TO-252包装说明:DPAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.32
Is Samacsys:N雪崩能效等级(Eas):90 mJ
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:150 V最大漏极电流 (Abs) (ID):6.7 A
最大漏极电流 (ID):6.7 A最大漏源导通电阻:0.42 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-252
JESD-30 代码:R-PSSO-G2JESD-609代码:e3
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:175 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):1.6 W最大脉冲漏极电流 (IDM):20 A
认证状态:Not Qualified子类别:FET General Purpose Power
表面贴装:YES端子面层:Matte Tin (Sn)
端子形式:GULL WING端子位置:SINGLE
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDD2512 数据手册

 浏览型号FDD2512的Datasheet PDF文件第2页浏览型号FDD2512的Datasheet PDF文件第3页浏览型号FDD2512的Datasheet PDF文件第4页浏览型号FDD2512的Datasheet PDF文件第5页 
August 2001  
FDD2512  
150V N-Channel PowerTrench MOSFET  
General Description  
Features  
This N-Channel MOSFET has been designed  
specifically to improve the overall efficiency of DC/DC  
converters using either synchronous or conventional  
switching PWM controllers. These MOSFETs feature  
faster switching and lower gate charge than other  
MOSFETs with comparable RDS(ON) specifications. The  
result is a MOSFET that is easy and safer to drive  
(even at very high frequencies), and DC/DC power  
supply designs with higher overall efficiency.  
6.7 A, 150 V RDS(ON) = 420 m@ VGS = 10 V  
DS(ON) = 470 m@ VGS = 6 V  
R
Low gate charge (8nC typical)  
Fast switching  
High performance trench technology for extremely  
low RDS(ON)  
.
D
D
G
G
S
TO-252  
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
VDSS  
Parameter  
Drain-Source Voltage  
Ratings  
Units  
150  
V
V
A
VGSS  
Gate-Source Voltage  
Drain Current – Continuous  
– Pulsed  
±20  
ID  
(Note 3)  
(Note 1a)  
(Note 1)  
6.7  
20  
42  
PD  
W
Power Dissipation  
(Note 1a)  
(Note 1b)  
3.8  
1.6  
TJ, TSTG  
Operating and Storage Junction Temperature Range  
55 to +175  
°C  
Thermal Characteristics  
Thermal Resistance, Junction-to-Case  
(Note 1)  
(Note 1a)  
(Note 1b)  
3.5  
40  
96  
RθJC  
RθJA  
RθJA  
°C/W  
°C/W  
°C/W  
Thermal Resistance, Junction-to-Ambient  
Thermal Resistance, Junction-to-Ambient  
Package Marking and Ordering Information  
Device Marking  
Device  
Reel Size  
Tape width  
Quantity  
FDD2512  
FDD2512  
13’’  
16mm  
2500 units  
FDD2512 Rev B2(W)  
2001 Fairchild Semiconductor Corporation  

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