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FDB8870_08 PDF预览

FDB8870_08

更新时间: 2024-10-01 03:36:23
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
11页 592K
描述
N-Channel PowerTrench㈢ MOSFET

FDB8870_08 数据手册

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May 2008  
tm  
FDB8870  
N-Channel PowerTrench MOSFET  
®
30V, 160A, 3.9mΩ  
General Description  
Features  
This N-Channel MOSFET has been designed specifically to  
improve the overall efficiency of DC/DC converters using  
either synchronous or conventional switching PWM  
controllers. It has been optimized for low gate charge, low  
r
= 3.9m, V = 10V, I = 35A  
GS D  
DS(ON)  
r
= 4.4m, V = 4.5V, I = 35A  
DS(ON)  
GS  
D
High performance trench technology for extremely low  
r
r
and fast switching speed.  
DS(ON)  
DS(ON)  
Low gate charge  
Applications  
High power and current handling capability  
DC/DC converters  
D
GATE  
G
DRAIN  
SOURCE  
TO-263AB  
FDB SERIES  
(FLANGE)  
MOSFET Maximum Ratings T = 25°C unless otherwise noted  
C
Symbol  
Parameter  
Ratings  
30  
Units  
V
V
Drain to Source Voltage  
Gate to Source Voltage  
V
V
DSS  
GS  
±20  
Drain Current  
o
160  
150  
A
A
Continuous (T = 25 C, V = 10V) (Note 1)  
C
GS  
o
I
Continuous (T = 25 C, V = 4.5V) (Note 1)  
C GS  
D
o
o
Continuous (T  
= 25 C, V = 10V, with R = 43 C/W)  
θJA  
23  
A
amb  
GS  
Pulsed  
Figure 4  
300  
A
E
P
Single Pulse Avalanche Energy (Note 2)  
Power dissipation  
mJ  
W
AS  
160  
D
o
o
Derate above 25 C  
1.07  
W/ C  
o
T , T  
Operating and Storage Temperature  
-55 to 175  
C
J
STG  
Thermal Characteristics  
o
R
R
R
Thermal Resistance Junction to Case TO-263  
0.94  
62  
C/W  
θJC  
θJA  
θJA  
o
Thermal Resistance Junction to Ambient TO-263 ( Note 3)  
C/W  
2
o
Thermal Resistance Junction to Ambient TO-263, 1in copper pad area  
43  
C/W  
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
24mm  
Quantity  
800 units  
FDB8870  
FDB8870  
TO-263AB  
330mm  
©2008 Fairchild Semiconductor Corporation  
FDB8870 Rev. A3  

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