ESD9L, SESD9L Series
Transient Voltage
Suppressors
ESD Protection Diodes with Ultra−Low
Capacitance
The ESD9L Series is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage, and
fast response time, make these parts ideal for ESD protection on designs
where board space is at a premium. Because of its low capacitance, it is
suited for use in high frequency designs such as USB 2.0 high speed and
antenna line applications.
www.onsemi.com
1
2
PIN 1. CATHODE
2. ANODE
Specification Features:
• Ultra Low Capacitance 0.5 pF
2
• Low Clamping Voltage
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.00 mm x 0.60 mm)
• Low Body Height: 0.016″ (0.4 mm)
• Stand−off Voltage: 3.3 V, 5 V
1
SOD−923
CASE 514AB
• Low Leakage
MARKING DIAGRAM
• Response Time is Typically < 1.0 ns
• IEC61000−4−2 Level 4 ESD Protection
• S and SZ Prefixes for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
X M
1
2
X
M
= Specific Device Code
= Date Code
• These Devices are Pb−Free and are RoHS Compliant
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
*Date Code orientation and/or position may
vary depending upon manufacturing location.
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
ORDERING INFORMATION
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
†
Device
Package
Shipping
ESD9LxxxST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
MAXIMUM RATINGS
SESD9LxxxST5G
SOD−923 8000/Tape & Reel
(Pb−Free)
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
10
15
kV
SZESD9LxxxST5G SOD−923 8000/Tape & Reel
(Pb−Free)
Total Power Dissipation on FR−5 Board
°P °
150
mW
D
(Note 1) @ T = 25°C
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
A
Storage Temperature Range
Junction Temperature Range
T
stg
−55 to +150
−55 to +150
260
°C
°C
°C
T
J
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics tables starting on
page 2 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
January, 2017 − Rev. 6
ESD9L/D