Datasheet > ESD9P5.0ST5G

ESD9P5.0ST5G

更新时间： 2024-02-24 02:19:15

品牌	Logo	应用领域
安森美 - ONSEMI		二极管
页数	文件大小	规格书
4页	130K
描述
Transient Voltage Suppressors ESD Protection Diodes with Ultra−Low Capacitance

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ESD9P5.0ST5G 数据手册

ESD9P5.0ST5G

Transient Voltage

Suppressors

ESD Protection Diodes with Ultra−Low

Capacitance

The ESD9P Series is designed to protect voltage sensitive components

that require low capacitance from ESD and transient voltage events.

Excellent clamping capability, low capacitance, low leakage, and fast

response time, make these parts ideal for ESD protection on designs that

utilize high−speed lines such as USB.

http://onsemi.com

Specification Features:

• Low Capacitance 1.3 pF

• Low Clamping Voltage

• Small Body Outline Dimensions:

0.039″ x 0.024″ (1.00 mm x 0.60 mm)

• Low Body Height: 0.016″ (0.4 mm)

SOD−923

CASE 514AB

• Stand−off Voltage: 5 V

• Low Leakage

• Response Time is Typically < 1.0 ns

• IEC61000−4−2 Level 4 ESD Protection

• This is a Pb−Free Device

MARKING DIAGRAM

T M

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

= Specific Device Code

= Date Code

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

ORDERING INFORMATION

MAXIMUM RATINGS

†

Device

Package

Shipping

Rating

IEC 61000−4−2 (ESD)

Symbol

Value

Unit

ESD9P5.0ST5G SOD−923

(Pb−Free)

8000/Tape & Reel

Contact

Air

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Total Power Dissipation on FR−5 Board

°P °

150

°C

(Note 1) @ T = 25°C

Junction and Storage Temperature Range

T , T

−55 to

+150

stg

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 2 of this data sheet.

Lead Solder Temperature − Maximum

(10 Second Duration)

260

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Semiconductor Components Industries, LLC, 2010

Publication Order Number:

May, 2010 − Rev. 0

ESD9P5.0S/D

12 3 4

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