ESD9X3.3ST5G SERIES
ESD Protection Diodes
In Ultra Small SOD−923 Package
The ESD9X Series is designed to protect voltage sensitive
components from ESD. Excellent clamping capability, low leakage,
and fast response time provide best in class protection on designs that
are exposed to ESD. Because of its small size, it is suited for use in
cellular phones, MP3 players, digital cameras and many other portable
applications where board space is at a premium.
http://onsemi.com
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Specification Features:
• Small Body Outline Dimensions:
0.039″ x 0.024″ (1.0 mm x 0.60 mm)
• Low Body Height: 0.017″ (0.43 mm) Max
• Stand−off Voltage: 3.3 V − 12 V
• Low Leakage
PIN 1. CATHODE
2. ANODE
MARKING
DIAGRAM
• Response Time is Typically < 1 ns
• ESD Rating of Class 3 (> 16 kV) per Human Body Model
• IEC61000−4−2 Level 4 ESD Protection
• These are Pb−Free Devices
X M
SOD−923
CASE 514AA
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94 V−0
X
M
= Specific Device Code
= Date Code
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
ORDERING INFORMATION
†
Device
ESD9XxxST5G
Package
Shipping
SOD−923 8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
Contact
±30
kV
ESD Voltage
Per Human Body Model
Per Machine Model
16
400
kV
V
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the table on page 2 of this data sheet.
Total Power Dissipation on FR−5 Board
⎪
(Note 1) @ T = 25°C
P
150
mW
A
D
Junction and Storage Temperature Range
T , T
−55 to
+150
°C
J
stg
Lead Solder Temperature − Maximum
T
260
°C
L
(10 Second Duration)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
October, 2006 − Rev. 1
ESD9X3.3ST5G/D