Datasheet > ESD9L5.0ST5GH

ESD9L5.0ST5GH

更新时间： 2024-01-17 19:11:15

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	126K
描述
Low Capacitance ESD Protection; Unidirectional

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ESD9L5.0ST5GH 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	Reach Compliance Code：	unknown
风险等级：	5.75	Base Number Matches：	1

ESD9L5.0ST5GH 数据手册

ESD9L5.0ST5G

Transient Voltage

Suppressors

ESD Protection Diodes with Ultra−Low

Capacitance

http://onsemi.com

The ESD9L is designed to protect voltage sensitive components that

require ultra−low capacitance from ESD and transient voltage events.

Excellent clamping capability, low capacitance, low leakage, and fast

response time, make these parts ideal for ESD protection on designs

where board space is at a premium. Because of its low capacitance, it is

suited for use in high frequency designs such as USB 2.0 high speed and

antenna line applications.

PIN 1. CATHODE

2. ANODE

Specification Features:

• Ultra Low Capacitance 0.5 pF

• Low Clamping Voltage

• Small Body Outline Dimensions:

0.039″ x 0.024″ (1.00 mm x 0.60 mm)

• Low Body Height: 0.016″ (0.4 mm)

SOD−923

CASE 514AB

• Stand−off Voltage: 5 V

• Low Leakage

MARKING DIAGRAM

• Response Time is Typically < 1.0 ns

• IEC61000−4−2 Level 4 ESD Protection

• This is a Pb−Free Device

D M

Mechanical Characteristics:

= Specific Device Code

= Date Code

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

ORDERING INFORMATION

†

Device

Package

Shipping

MAXIMUM RATINGS

ESD9L5.0ST5G SOD−923

(Pb−Free)

8000/Tape & Reel

Rating

Symbol

Value

Unit

IEC 61000−4−2 (ESD)

Contact

Air

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Total Power Dissipation on FR−5 Board

°P °

150

(Note 1) @ T = 25°C

Storage Temperature Range

Junction Temperature Range

−55 to +150

−55 to +125

260

°C

stg

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 2 of this data sheet.

Lead Solder Temperature − Maximum

(10 Second Duration)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Publication Order Number:

November, 2009 − Rev. 8

ESD9L5.0S/D

12 3 4

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