Datasheet > EMB8F

EMB8F

更新时间： 2024-11-21 17:14:59

品牌	Logo	应用领域
星海 - CZSTARSEA		/
页数	文件大小	规格书
2页	84K
描述
MBF

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中文翻译

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数据手册

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EMB8F 数据手册

EMB2F THRU EMB8F

GLASS PASSIVATED SUPER FAST RECOVERY BRIDGE RECTIFIERS

Voltage Range - 200 to 600Volts Current -0.5/0.8 Ampere

MBF

FEATURES

Ideal for printed circuit board

Reliable low cost construction utilizing

molded plastic technique

0.276(7.00)

0.252(6.40)

0.059(1.50)

Max

High temperature soldering guaranteed:

260 / 10 seconds at 5 lbs., (2.3kg) tension

Small size, simple installation

Leads solderable per MIL-STD-202,Method 208

High surge current capability

0.195(4.95)

0.177(4.50)

0.106 (2.70)

0.091 (2.30)

0.028(0.70)

0.020(0.50)

Super fast switching for high efficiency

Glass passivated chip junction

Green compound(halogen&Sb2O3 free)

0.161 (4.10)

0.142 (3.60)

MECHANICAL DATA

0.067(1.70)

0.051(1.30)

0.014 (0.35)

0.006(0.150)

Case: Molded plastic body

Terminals: Plated leads solderable per MIL-STD-750,

Method 2026

Polarity: Polarity symbols marked on case

Mounting Position: Any

0.043(1.10)

0.020(0.50)

0.008 (0.20)

Max

Dimensions in inches and (millimeters)

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25 ambient temperature unless otherwise specified.

Single phase half-wave 60Hz,resistive or inductive load, for capacitive load derate current by 20%.

SYMBOLS

UNITS

EMB2F

EMB4F

EMB6F

EMB8F

Maximum repetitive peak reverse voltage

Maximum RMS voltage

VRRM

VRMS

VDC

100

200

140

200

400

280

400

600

420

600

Maximum DC blocking voltage

Maximum average forward rectified current

On glass-epoxy P.C.B.(Note1)

On aluminum substrate(Note2)

Peak forward surge current,

100

IF(AV)

IFSM

0.5

0.8

8.3ms single half sine-wave superimposed on

rated load

Maximum instantaneous forward voltage drop

per leg at 0.4A

0.95

1.25

1.7

Maximum DC reverse current

at rated DC blocking voltage

TA=25

5.0

TA=125

500

Typical thermal resistance(NOTE 3)

R JL

R JA

trr

Maximum reverse recovery time

(NOTE 4)

Operating temperature range

storage temperature range

-55 to +150

TSTG

NOTES:1.On glass epoxy P.C.B. mounted on 0.05x0.05''(1.3x1.3mm) pads.

2.On aluminum substrate P.C.B. with an area of 0.8''x0.8''(20x20mm) mounted on 0.05X0.05''(1.3X1.3mm) solder pad.

3.Thermal resistance form junction to ambient and junction to lead mounted on P.C.B. with 0.2X0.2''(5X5mm)

4.Reverse recovery condition I^F=0.5A,I^R=1.0A,Irr=0.25A.

copper pads.

DN:S16F04A1

STAR SEA

中文翻译

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