ED(X)
bidirectional esd suppressor
EU
features
• (16kV) IEC 61000-4-2 rating
• Surface mount package
• High component density
• Products with lead-free terminations meet EU RoHS
and China RoHS requirements
applications
• ESD suppression
• Transient suppression
dimensions and construction
Bonding
Wire
S05
S03
L
L
p
P
Die
Bonding
Wire
d
Pad
Lead
Die
Pad
Si
W
W
Lead
P
Si
Wafer
Wafer
d
Molded
Resin
Molded
Resin
Dimensions inches (mm)
Package Total
Code Power
Pins
Pkg Ht
0.ꢀ
L
0.ꢀ
W
0.ꢀ
p
0.1
P
0.1
d 0.05
.114
.091
.075
.039
.017
S03 ꢀꢀ5mw
3
5
6
––
S06
(2.90)
(2.30)
(1.90)
(1.0)
(0.43)
L
p
.114
(2.90)
.110
(2.80)
.037
(0.95)
.075
(1.90)
.039
(1.0)
.017
(0.43)
Bonding
Wire
S05 ꢀꢀ5mw
S06 ꢀꢀ5mw
.114
(2.90)
.110
(2.80)
.037
(0.95)
.039
(1.0)
.017
(0.43)
Lead
––
W
Die
d
Pad
Si
Wafer
Molded
Resin
circuit schematic
EDA
EDB
EDC
EDD
4
5
6
3
2
1
4
3
2
1
4
3
3
1
2
5
6
2
1
5
ordering information
New Part #
EDA
S03
T
TE
16V
Package
Code
Lead
Plating
Type
Packaging
Voltage
EDA
EDC
EDB
EDD
From table above
T: Sn
TE: 7" embossed
plastic tape
5V0
16V
For further information on packaging, please refer to Appendix A.
Specifications given herein may be changed at any time without prior notice. Please confirm technical specifications before you order and/or use.
2/24/08
196
KOA Speer Electronics, Inc. • 199 Bolivar Drive • Bradford, PA 16701 • USA • 814-362-5536 • Fax: 814-362-8883 • www.koaspeer.com