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DS92LV0421SQE/NOPB PDF预览

DS92LV0421SQE/NOPB

更新时间: 2024-02-08 13:46:15
品牌 Logo 应用领域
德州仪器 - TI 驱动接口集成电路
页数 文件大小 规格书
58页 1257K
描述
具有 LVDS 并行接口的 10MHz 至 75MHz Channel-Link II 串行器 | NJK | 36 | -40 to 85

DS92LV0421SQE/NOPB 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:QFN
包装说明:LLP-36针数:36
Reach Compliance Code:compliantECCN代码:5A991.B.1
HTS代码:8542.39.00.01Factory Lead Time:1 week
风险等级:1.22Is Samacsys:N
差分输出:YES驱动器位数:24
输入特性:DIFFERENTIAL接口集成电路类型:LINE DRIVER
接口标准:I2CJESD-30 代码:S-XQCC-N36
JESD-609代码:e3长度:6 mm
湿度敏感等级:3功能数量:1
端子数量:36最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装等效代码:LCC36,.25SQ,20
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度(摄氏度):260电源:1.8,3.3 V
认证状态:Not Qualified最大接收延迟:
座面最大高度:0.8 mm子类别:Line Driver or Receivers
最大压摆率:100 mA最大供电电压:1.89 V
最小供电电压:1.71 V标称供电电压:1.8 V
电源电压1-最大:1.89 V电源电压1-分钟:1.71 V
电源电压1-Nom:1.8 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:Matte Tin (Sn)
端子形式:NO LEAD端子节距:0.5 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:6 mmBase Number Matches:1

DS92LV0421SQE/NOPB 数据手册

 浏览型号DS92LV0421SQE/NOPB的Datasheet PDF文件第1页浏览型号DS92LV0421SQE/NOPB的Datasheet PDF文件第3页浏览型号DS92LV0421SQE/NOPB的Datasheet PDF文件第4页浏览型号DS92LV0421SQE/NOPB的Datasheet PDF文件第5页浏览型号DS92LV0421SQE/NOPB的Datasheet PDF文件第6页浏览型号DS92LV0421SQE/NOPB的Datasheet PDF文件第7页 
DS92LV0421, DS92LV0422  
SNLS325D MAY 2010REVISED DECEMBER 2016  
www.ti.com  
Table of Contents  
7.3 Feature Description................................................. 24  
7.4 Device Functional Modes........................................ 36  
7.5 Register Maps......................................................... 37  
Application and Implementation ........................ 40  
8.1 Application Information............................................ 40  
8.2 Typical Application .................................................. 43  
Power Supply Recommendations...................... 46  
1
2
3
4
5
6
Features.................................................................. 1  
Applications ........................................................... 1  
Description ............................................................. 1  
Revision History..................................................... 2  
Pin Configuration and Functions......................... 4  
Specifications......................................................... 9  
6.1 Absolute Maximum Ratings ...................................... 9  
6.2 ESD Ratings.............................................................. 9  
6.3 Recommended Operating Conditions....................... 9  
6.4 Thermal Information................................................ 10  
6.5 Electrical Characteristics: Serializer DC ................. 10  
6.6 Electrical Characteristics: Deserializer DC ............. 11  
8
9
10 Layout................................................................... 47  
10.1 Layout Guidelines ................................................. 47  
10.2 Layout Example .................................................... 49  
11 Device and Documentation Support ................. 50  
11.1 Device Support...................................................... 50  
11.2 Documentation Support ........................................ 50  
11.3 Related Links ........................................................ 50  
11.4 Receiving Notification of Documentation Updates 50  
11.5 Community Resources.......................................... 50  
11.6 Trademarks........................................................... 50  
11.7 Electrostatic Discharge Caution............................ 51  
11.8 Glossary................................................................ 51  
6.7 Electrical Characteristics: DC and AC Serial Control  
Bus........................................................................... 13  
6.8 Timing Requirements: Serial Control Bus............... 13  
6.9 Switching Characteristics: Serializer....................... 14  
6.10 Switching Characteristics: Deserializer................. 15  
6.11 Typical Characteristics.......................................... 22  
Detailed Description ............................................ 23  
7.1 Overview ................................................................. 23  
7.2 Functional Block Diagrams ..................................... 23  
7
12 Mechanical, Packaging, and Orderable  
Information ........................................................... 51  
4 Revision History  
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.  
Changes from Revision C (April 2013) to Revision D  
Page  
Added Device Information table, Pin Configuration and Functions section, Specifications section, ESD Ratings table,  
Thermal Information table, Typical Characteristics section, Detailed Description section, Application and  
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation  
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1  
Added OpenLDI LVDS as an acceptable parallel interface to the DS92LV024x chipset....................................................... 1  
Changed RXIN and RXCLKIN to TXOUT and TXCLKOUT to correct pin name typos ........................................................ 6  
Changed output state of deserializer when PDB = 1 to be TRI-STATE, not logic high......................................................... 6  
Deleted Power dissipation rows from the Absolute Maximum Ratings table ......................................................................... 9  
Changed Junction-to-ambient, RθJA, values in Thermal Information table From: 27.4°C/W To: 33.8°C/W (NJK) and  
From: 27.7°C/W to: 28.8°C/W (RHS) ................................................................................................................................... 10  
Changed Junction-to-case, RθJC(top), values in Thermal Information table From: 4.5°C/W To: 15.8°C/W (NJK) and  
From: 3.0°C/W To: 9.3°C/W (RHS) ...................................................................................................................................... 10  
Deleted note in Electrical Characteristics: Serializer DC table stating that conditions are verified by characterization  
or design and not tested in production, as this note only applies to a subset of tested parameters ................................... 10  
Changed minimum and maximum value of serializer IIN for LVDS receiver DC specification ............................................. 10  
Changed de-emphasis test condition for serializer IDD supply current ................................................................................. 11  
Changed IOL condition for serial bus VOL parameter from 3 mA to 0.5 mA ......................................................................... 13  
Changed RPU = 10 kΩ condition for the Serial Control Bus Characteristics of tR and tF ................................................... 13  
Changed tPLD footnote to include tDDLT parameter................................................................................................................ 14  
Changed notation for serial bit stream UI footnote to clarify 1 UI = 1 / (28 x CLK) ............................................................. 14  
Changed footnote for deserializer LVDS output units to clarify that parallel interface UI refers to Channel Link format  
(1 UI = 1 / [7 × CLK]) instead of Channel Link II format (1 UI = 1 / [28 × CLK]) ................................................................. 15  
Changed DS92LV0422 LVDS Transmitter Pulse Positions image to correct diagram labeling........................................... 18  
Changed parallel interface description of deserializer From: wide parallel output bus To: Channel Link LVDS clock  
2
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Product Folder Links: DS92LV0421 DS92LV0422  
 

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