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DRV8812_14 PDF预览

DRV8812_14

更新时间: 2024-11-09 02:58:23
品牌 Logo 应用领域
德州仪器 - TI 电动机控制
页数 文件大小 规格书
22页 1206K
描述
DUAL-BRIDGE MOTOR CONTROLLER IC

DRV8812_14 数据手册

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DRV8812  
www.ti.com  
SLVS997F OCTOBER 2009REVISED AUGUST 2013  
DUAL-BRIDGE MOTOR CONTROLLER IC  
Check for Samples: DRV8812  
1
FEATURES  
APPLICATIONS  
2
Dual-H-Bridge Current-Control Motor Driver  
Automatic Teller Machines  
Money Handling Machines  
Video Security Cameras  
Printers  
Capable of Driving a Bipolar Stepper or  
Two DC Motors  
Two-Bit Winding Current Control Allows Up  
to Four Current Levels  
Scanners  
Low MOSFET On-Resistance  
Office Automation Machines  
Gaming Machines  
Factory Automation  
Robotics  
1.6-A Maximum Drive Current at 24 V, 25°C  
Built-In 3.3-V Reference Output  
Industry-Standard Parallel Digital Control  
Interface  
8-V to 45-V Operating Supply Voltage Range  
Thermally Enhanced HTSSOP and QFN  
Surface Mount Packages  
DESCRIPTION  
The DRV8812 provides an integrated motor driver solution for printers, scanners, and other automated  
equipment applications. The device has two H-bridge drivers, and can drive a bipolar stepper motor or two DC  
motors. The output driver block for each consists of N-channel power MOSFET’s configured as full H-bridges to  
drive the motor windings. The DRV8812 is capable of driving up to 1.6-A of output current (with proper  
heatsinking, at 24 V and 25°C).  
A simple parallel digital control interface is compatible with industry-standard devices. Decay mode is  
programmable.  
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage  
lockout and overtemperature.  
The DRV8812 is available in a 28-pin HTSSOP package with PowerPAD™ and in a 28-pin QFN package  
PowerPAD™ (Eco-friendly: RoHS & no Sb/Br).  
ORDERING INFORMATION(1)  
ORDERABLE PART  
NUMBER  
TOP-SIDE  
MARKING  
TA  
PACKAGE(2)  
PowerPAD™ (HTSSOP) - PWP  
PowerPAD™ (QFN) - RHD  
Reel of 2000  
Reel of 3000  
DRV8812PWPR  
DRV8812RHDR  
–40°C to 85°C  
DRV8812  
(1) For the most current packaging and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2013, Texas Instruments Incorporated  

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