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DRV8821_10 PDF预览

DRV8821_10

更新时间: 2024-09-18 06:54:35
品牌 Logo 应用领域
德州仪器 - TI 驱动器电动机控制电机控制器
页数 文件大小 规格书
16页 329K
描述
DUAL STEPPER MOTOR CONTROLLER/DRIVER

DRV8821_10 数据手册

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DRV8821  
www.ti.com  
SLVS912C JANUARY 2009REVISED JANUARY 2010  
DUAL STEPPER MOTOR CONTROLLER/DRIVER  
Check for Samples: DRV8821  
1
FEATURES  
Simple Step/Direction Interface  
2
Dual PWM microstepping motor driver  
Fully Protected Against Undervoltage,  
Overtemperature, and Overcurrent  
Built-In Microstepping Indexers  
Up to 1.5-A Current Per Winding  
Thermally Enhanced Surface Mount Package  
Three-Bit Winding Current Control Allows  
up to Eight Current Levels  
APPLICATIONS  
Printers  
Scanners  
Office Automation Machines  
Gaming Machines  
Factory Automation  
Robotics  
Low MOSFET On-Resistance  
Selectable Slow or Mixed Decay Modes  
8-V to 32-V Operating Supply Voltage Range  
Internal Charge Pump for Gate Drive  
Built-in 3.3-V Reference  
DESCRIPTION/ORDERING INFORMATION  
The DRV8821 provides a dual microstepping-capable stepper motor controller/driver solution for printers,  
scanners, and other office automation equipment applications.  
Two independent stepper motor driver circuits include four H-bridge drivers and microstepping-capable indexer  
logic. Each of the motor driver blocks employ N-channel power MOSFETs configured as an H-bridge to drive the  
motor windings.  
A simple step/direction interface allows easy interfacing to controller circuits. Pins allow configuration of the  
motor in full-step, half-step, quarter-step, or eighth step modes, and the selection of slow or mixed decay modes.  
Internal shutdown functions are provided for over current protection, short circuit protection, under voltage  
lockout and overtemperature.  
The DRV8821 is packaged in a 48-pin HTSSOP package (Eco-friendly : RoHS & no Sb/Br).  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
Reel of 2000  
Tube of 40  
DRV8821DCAR  
–40°C to 85°C  
PowerPad™ (HTSSOP) - DCA  
DRV8821  
DRV8821DCA  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPad, PowerPAD are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009–2010, Texas Instruments Incorporated  

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