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DRV8818_16 PDF预览

DRV8818_16

更新时间: 2024-11-09 02:58:23
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德州仪器 - TI /
页数 文件大小 规格书
20页 748K
描述
Stepper Motor Controller IC

DRV8818_16 数据手册

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DRV8818  
www.ti.com  
SLVSAX9A SEPTEMBER 2011REVISED FEBRUARY 2012  
STEPPER MOTOR CONTROLLER IC  
Check for Samples: DRV8818  
1
FEATURES  
2
Pulse Width Modulation (PWM) Microstepping  
Motor Driver  
Lower Rds(on)  
Thermally Enhanced Surface Mount Package  
Built-In Microstepping Indexer  
Up to 2.5-A Current Per Winding  
APPLICATIONS  
Printers  
Microstepping Indexer Provides up to  
1/8-Step Operation  
Textile Machinery  
Positioning/Tracking  
Factory Automation  
Robotics  
Low 0.37-Ω (HS + LS) MOSFET  
On-Resistance (at 25°)  
Programmable Mixed Decay, Blanking, and  
Off Time  
Pin-Compatible Upgrade to DRV8811 With  
DESCRIPTION/ORDERING INFORMATION  
The DRV8818 provides an integrated stepper motor driver solution for printers, scanners, and other automated  
equipment applications. The device has two H-bridge drivers, as well as microstepping indexer logic to control a  
stepper motor.  
The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the  
motor windings.  
A simple step/direction interface allows easy interfacing to controller circuits. Pins allow configuration of the  
motor in full-step, half-step, quarter-step, or eighth-step modes. Decay mode and PWM off time are  
programmable.  
Internal shutdown functions are provided for over current protection, short circuit protection, under-voltage  
lockout and overtemperature.  
The DRV8818 is packaged in a PowerPAD28-pin HTSSOP package with PowerPAD(Eco-friendly: RoHS  
and no Sb/Br).  
ORDERING INFORMATION(1)  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
Reel of 2000  
Tube of 50  
DRV8818PWPR  
PowerPAD(HTSSOP) PWP  
DRV8818  
DRV8818PWP  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 20112012, Texas Instruments Incorporated  

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